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Substrate peeling device, method of peeling substrate, and method of manufacturing display device

A technology of peeling device and substrate, applied in the direction of lamination device, manufacturing tool, final product manufacturing, etc., can solve the problem of low flexibility

Active Publication Date: 2018-05-01
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Relatively low flexibility of the carrier substrate

Method used

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  • Substrate peeling device, method of peeling substrate, and method of manufacturing display device
  • Substrate peeling device, method of peeling substrate, and method of manufacturing display device
  • Substrate peeling device, method of peeling substrate, and method of manufacturing display device

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Embodiment Construction

[0027] Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, inventive concepts may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the thicknesses of layers and regions may be exaggerated for clarity. It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Like reference numerals may refer to like elements throughout the specification and drawings.

[0028] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0029] figure 1 is a flowchart illustrating a method for peeling a substrate according to an exemplary embodiment of the present invention. refer to figure 1 , the method for peeling off the substrate includes: i...

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PUM

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Abstract

Provided are a substrate peeling device, a method of peeling a substrate, and a method for manufacturing a display device. Laser light having a power density is supplied to the substrate combination. The substrate combination includes a first substrate and a second substrate bonded to the first substrate. The second substrate is separated from the first substrate. Optical properties of the first substrate separated from the second substrate are measured. The power density of the laser is adjusted based on the optical properties of the first substrate.

Description

[0001] This application claims Korean Patent Application No. 10-2013-0025733 filed with the Korean Intellectual Property Office on March 11, 2013 and Korean Patent Application No. 10-2013-0146379 filed with the Korean Intellectual Property Office on November 28, 2013 The priority of the patent application, the entire content of the above patent application is hereby incorporated by reference. technical field [0002] The present invention relates to a substrate peeling device, a method for peeling a substrate, and a method for manufacturing a flexible display device, and more particularly, to a substrate peeling device using a laser, a method for peeling a substrate A method and a method for manufacturing a flexible display device. Background technique [0003] When fabricating a flexible display device, a carrier substrate is used to support the structure of the flexible display device while fabricating the structure of the flexible display device. The flexibility of the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/67H10K99/00
CPCB23K26/009B23K26/032B23K26/0626B32B43/006G01N21/59B32B37/12B32B2307/416B32B2310/0843B32B2457/20B23K26/361Y10T156/1158Y10T156/1917Y02E10/549Y02P70/50H10K71/70H10K71/80H10K77/111H10K59/12H10K59/1201H10K2102/311B23K26/362B32B38/10G02F1/133305G02F1/1368H01L21/6835H01L22/20H01L27/1218H01L27/1259H01L2221/68386
Inventor 林亨哲金英求赵显俊
Owner SAMSUNG DISPLAY CO LTD