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A kind of led downlight

A technology for LED downlights and lampshades, which is applied to lighting devices, cooling/heating devices of lighting devices, light sources, etc., and can solve problems such as lack of special optimization design, design of heat dissipation air flow direction optimization, and heat that cannot be discharged in time. problem, to achieve good exhaust effect, improve heat dissipation effect, and small resistance effect

Active Publication Date: 2016-06-08
宁波丽安电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the existing LED downlights on the market adopt a passive heat dissipation method, that is, the LED light-emitting circuit board is attached to a heat dissipation plate, and behind the heat dissipation plate is a heat dissipation strip or heat dissipation rod. However, even so, since LED downlights are generally installed in holes in the ceiling , so the heat is often closed in the hole and cannot be discharged in time, so even if there is a heat sink, it cannot effectively dissipate heat for a long time
Some high-power LED downlights with high heat dissipation requirements often use cooling fans to actively dissipate heat from the heat sink, but there is no design to optimize the flow of heat dissipation air, and the LED downlights currently on the market have a high heat dissipation effect on the surface of the heat sink. There is no special optimization design for the shape of the bar or cooling rod and how to cooperate with the cooling fan, so in fact, further research and improvement can be carried out on these two aspects

Method used

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  • A kind of led downlight
  • A kind of led downlight
  • A kind of led downlight

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Such as figure 1 , 2 As shown, the LED downlight includes an LED light-emitting circuit board 1, a heat dissipation plate 2 is installed on the top of the LED light-emitting circuit board 1, and the upper surface of the heat dissipation plate 2 is a plurality of centripetally distributed heat dissipation rods 3 with a streamlined cross-section. The central position of the upper surface of 2 is provided with confluence void area 4 (referring to Figure 4 ); the top of the cooling plate 2 is equipped with a cover plate 5 that matches the shape of the cooling plate 2; the cover plate 5 is provided with a through hole 6 that matches the shape and position of the confluence space 4; the top of the cover plate 5 is equipped with a tubular airflow guide Cover 7; the shape and position of the lower opening of the airflow channel 8 in the middle of the airflow guide cover 7 cooperate with the through hole 6; the main cooling fan 9 is installed in the airflow channel 8; the lowe...

Embodiment 2

[0027] Such as Figure 8 , 9 As shown, the difference between this embodiment and Embodiment 1 is that: four auxiliary cooling fans 19 are connected in series in the power supply line; an orientation detection device is installed on the top of the lampshade 17; Four groups of azimuth short-circuit electrodes 27 on the inner wall of the housing 26; each group of azimuth short-circuit electrodes 27 includes two arc-shaped strip electrode pieces 22 insulated; The positive and negative wires are connected; the bottom surface of the cylindrical shell 26 is a conical concave surface; the cylindrical shell 26 is also provided with a conductive metal ball 25 .

[0028] When the LED downlight is installed on a vertical wall, the conductive metal ball 25 touches a set of azimuth short-circuit electrodes 27 at the bottom, so that the two electrode pieces 22 are electrically connected, and the auxiliary cooling fan 19 at the bottom is in a short-circuit state , the power of the other th...

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Abstract

The invention discloses an LED (Light-Emitting Diode) tube lamp and relates to the technical field of non-portable indoor-illumination lamps. The LED tube lamp comprises an LED luminescent circuit board, wherein the upper part of the LED luminescent circuit board is provided with a cooling plate; the upper surface of the cooling plate is provided with multiple cooling rods, and the cooling rods are centripetally distributed and have streamlined cross sections; the central position of the upper surface of the cooling plate is provided with a conflux hollow region; a cover plate matched with the cooling plate in shape is arranged above the cooling plate; the cover plate is provided with a through hole matched with the conflux hollow region in shape and position; a tubular airflow guide housing is arranged above the cover plate; the shape and position of an opening at the lower part of an airflow channel in the middle of the airflow guide housing are matched with those of the through hole; the airflow channel is internally provided with a main cooling fan; the lower part of the LED luminescent circuit board is provided with a transparent plate; an air guide gasket is arranged between the edge of the transparent plate and a tube lamp base. The LED tube lamp has the beneficial effects of sufficient air convection and good heat radiation effect.

Description

technical field [0001] The invention relates to the technical field of non-portable indoor lighting fixtures. Background technique [0002] Most of the existing LED downlights on the market adopt a passive heat dissipation method, that is, the LED light-emitting circuit board is attached to a heat dissipation plate, and behind the heat dissipation plate is a heat dissipation strip or heat dissipation rod. However, even so, since LED downlights are generally installed in holes in the ceiling , so the heat is often closed in the holes and cannot be discharged in time, so even if there is a heat sink, it cannot effectively dissipate heat for a long time. Some high-power LED downlights with high heat dissipation requirements often use cooling fans to actively dissipate heat from the heat sink, but there is no design to optimize the flow of heat dissipation air, and the LED downlights currently on the market have a high heat dissipation effect on the surface of the heat sink. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S8/00F21V29/67F21V23/00F21Y115/10
Inventor 陆亚丽
Owner 宁波丽安电子有限公司
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