a speaker
A loudspeaker and circuit technology, applied in the field of loudspeakers, can solve the problems of increasing inductance components, increasing the cost of circuit parts and process costs, reducing the effective space of the loudspeaker, etc., and achieving the effects of simple processing technology, improved loudspeaker quality, and low product cost.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0022] see figure 2 , in this embodiment, the lines include a first line 51 and a second line 52, one end of the first line 51 is connected to an input end of the speaker, and the other end of the first line 51 is connected to the audio coil 2, one end of the second line 52 is connected to the other input end of the speaker, and the other end of the second line 52 is connected to the other end of the audio coil 2. That is, the lines are respectively connected in series at the two ends of the audio coil 2, therefore, the high-frequency signal can be blocked from entering the audio coil 2 from both ends of the audio coil 2, preventing the high-frequency signal from entering the audio coil 2 from any end of the audio coil 2, Moreover, connecting two lines in series in the speaker also improves the high-frequency choke effect of the casing circuit 5 .
[0023] see figure 2 , in this embodiment, in order to further block the high-frequency signal from entering the audio coil 2,...
Embodiment 2
[0029] In the above embodiments, the substrate is a PCB circuit board or a plastic board, and the first circuit 51 , the second circuit 52 , the first wire 53 and the second wire 54 are disposed on the substrate through a surface metallization process. In order to further increase the effective space in the sound cavity of the speaker, in this embodiment, the substrate is the housing 4, that is, the first line 51, the second line 52, the first wire 53 and the second wire 54 pass through the surface The metallization process is arranged on the casing 4 . Soldering pads are set on the housing 4, and the lines on the housing 4 are connected to the audio coil 2 and the input end of the loudspeaker through wires, that is, the first line 51 and the second line 52 are respectively connected in series to the input end of the loudspeaker through wires and audio coil 2. Therefore, in this embodiment, the housing 4 is used as the substrate of the first line 51, the second line 52, the f...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

