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Thermosetting resin composition and printed circuit board filled with the resin composition

A technology of resin composition and printed circuit board, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of reduced workability and short usable time, so as to prevent the reduction of workability, prolong the storage period, Excellent grinding effect

Active Publication Date: 2017-03-22
TAIYO INK SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problems of the one-component composition include strict management of the storage conditions of the composition and a short usable time
In particular, a resin composition that can be used for a long time is desired because there is a concern that workability may be reduced if the usable time is short.

Method used

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  • Thermosetting resin composition and printed circuit board filled with the resin composition
  • Thermosetting resin composition and printed circuit board filled with the resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0048] Although this invention is demonstrated in more detail based on an Example and a comparative example, the technical scope of this invention and its embodiment are not limited to these. The "part" or "%" in an Example and a comparative example is a basis of weight unless otherwise indicated. The property value test of the composition of this Example was performed by the method described below.

[0049] (preparation of paste)

[0050] The components shown in Table 1 were pre-mixed by a mixer according to their respective compounding ratios (parts by mass), and then dispersed by a three-roll mill to prepare the thermosetting resin compositions of Examples 1-2 and Comparative Examples 1-3.

[0051] Table 1

[0052]

[0053] Epoxy resin A-1 not having an alicyclic skeleton: Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, "jER-828")

[0054] Epoxy resin A-2 not having an alicyclic skeleton: bisphenol F type epoxy resin (manufactured by M...

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Abstract

The invention provides a thermosetting resin composition which inhibits the tackification of the viscosity over time, fills holes of a printed circuit board and has an excellent abrasive property after having been cured, and a printed circuit board filled with the same. The thermosetting resin composition of this invention is characterized in that it comprises (A) an epoxy resin not having an alicyclic skeleton, (B) an epoxy resin having an alicyclic skeleton, (C) a curing catalyst, and (D) a filler.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, in particular to a thermosetting resin composition useful as a permanent hole filling material for via holes, through holes, etc. in printed circuit boards such as multilayer substrates and double-sided substrates . In particular, it relates to a thermosetting resin composition that suppresses an increase in viscosity over time, has excellent filling properties into holes of printed wiring boards, and has excellent abrasiveness after curing. Background technique [0002] In recent years, printed circuit boards are desired to be thinner and thinner in order to cope with miniaturization and higher functionality of electronic equipment. Therefore, a construction method such as a build-up construction method in which an insulating layer is formed above and below a core material on a printed circuit board to form a necessary circuit, and then an insulating layer is further formed to form a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00H05K1/02
CPCC08G59/226C08G59/24C08L2205/02H05K3/0094H05K2201/0959
Inventor 加藤贤治顾华民
Owner TAIYO INK SUZHOU
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