Fingerprint recognition detection assembly and terminal device
A technology of fingerprint identification and detection components, which is applied in the field of biometric identification, can solve the problems of difficult formation of fingerprint patterns and too far away, and achieve the effect of preventing ESD and improving reliability
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Embodiment 1
[0054] Figure 4 It is a schematic diagram of the grounding of the grounding lead in one embodiment of the present invention.
[0055] A plurality of through holes 111 are formed on the substrate 11 , and conductive materials, such as silver, copper, gold, aluminum and other metals or combinations thereof, are respectively disposed in the plurality of through holes 111 .
[0056] In some embodiments, the shape of each through hole 111 is preferably circular, because in the manufacturing process, if the diameter of the through hole is made too large, the substrate panel is easy to break, and if the diameter is too small, the filling process cannot be realized. Therefore, the diameter of the through hole 111 is preferably in the range of 20 μm-45 μm, but the present invention is not limited thereto. When the through hole 111 is polygonal, its diameter refers to the diameter of its circumscribed circle.
[0057] The manufacturing process for forming the plurality of through hol...
Embodiment 2
[0060] Figure 5 It is a schematic diagram of the grounding of the grounding lead in another embodiment of the present invention.
[0061] In this embodiment, the fingerprint recognition and detection component 1 further includes: a side lead 33 , a first lead 34 , and a second lead 35 .
[0062] Wherein, the substrate 11 has a first surface a, a second surface b corresponding to the first surface, and a side surface c connecting the first surface a and the second surface b.
[0063] The side leads 33 are formed on the side c of the substrate 11 by sputtering or silk printing, and the side leads 33 connect the first surface a and the second surface b of the substrate 31 .
[0064] The first lead 34 is formed on the first surface a of the substrate 11 by sputtering or silk printing. One end of the first lead 34 is connected to the ground lead 131 , and the other end is connected to the first end of the side lead 33 . The second lead 35 is formed on the second surface b of the...
Embodiment 3
[0066] Figure 6 It is a schematic diagram of the grounding of the grounding wire in another embodiment of the present invention.
[0067] In this embodiment, the fingerprint recognition and detection component 1 further includes: a flexible substrate 43 and a lead wire 44 .
[0068] The substrate 11 has a first surface a, a second surface b corresponding to the first surface, and a side surface c connecting the first surface and the second surface.
[0069] A groove 1a is also formed on the first surface a of the substrate 11, the flexible base material 43, the shielding layer 13 and the fingerprint recognition sensing element 12 are accommodated in the groove 1a, and the side c of the substrate 11 is also provided with a groove 1a. The groove 1 c accommodates the flexible substrate 43 .
[0070] The total height of the flexible substrate 43 , the fingerprint identification sensing element 12 and the shielding layer 13 can match the depth of the groove 1 a, for example, the...
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Abstract
Description
Claims
Application Information
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