Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing stepped circuit board

A manufacturing method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of high cost, complex manufacturing process, and difficulty in resisting dry film, and achieve low production cost, simple process, and guaranteed quality effect

Active Publication Date: 2014-10-01
BOMIN ELECTRONICS CO LTD +1
View PDF4 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, it is difficult to prepare stepped circuit boards by using the traditional fine circuit technology. The main technical difficulties include: (1) Due to the copper thickness gradient on the board surface, it is difficult for the anti-corrosion dry film to form a good adhesion to the board surface when the dry film is pressed by the roller. lead to quality defects such as open circuits and gaps in the etching stage
(2) In the etching stage, due to the differences in copper thickness in different areas, it is difficult to ensure that the line width and line spacing in different copper thickness areas are the same under the same etching conditions, which affects the quality of the product
(3) The production process is complicated and the cost is too high, so it is not suitable for mass production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A step circuit production technology without grinding process, taking the production of ordinary double-sided board as an example, in the specific implementation process, the circuit board will reveal the area that needs to thicken the copper through the first pattern transfer, and the electroplating thickens to meet the copper thickness of the line Requirements; liquid photosensitive ink is used as the resist in the second graphic transfer, and the lines in different copper thickness areas are accurately compensated, so that under acidic etching conditions, the line width and line spacing of different copper thickness areas are all 3 / 3mil requirement.

[0038] Production Method:

[0039] (1) Cutting: Cutting the H / Hoz substrate, the cutting size is 468*412mm.

[0040] (2) Drilling: Use mechanical drilling to drill holes in the circuit board.

[0041] (3) The first pattern transfer: use a dry film with a model number of DG38 and a thickness of 38 μm. The lamination tem...

Embodiment 2

[0049] A step circuit production technology without grinding process, taking the production of ordinary double-sided board as an example, in the specific implementation process, the circuit board will reveal the area that needs to thicken the copper through the first pattern transfer, and the electroplating thickens to meet the copper thickness of the line Requirements; liquid photosensitive ink is used as the resist in the second graphic transfer, and the lines in different copper thickness areas are accurately compensated, so that under acidic etching conditions, the line width and line spacing of different copper thickness areas are all 3 / 3mil requirement.

[0050] Production Method:

[0051] (1) Cutting: cut the Taiguang EM825 substrate, and the cutting size is 468*412mm.

[0052] (2) Drilling: Use mechanical drilling to drill holes in the circuit board.

[0053] (3) The first graphics transfer: use a dry film with a model number of DG38 and a thickness of 38 μm. The la...

Embodiment 3

[0061] A step circuit production technology without grinding process, taking the production of ordinary double-sided board as an example, in the specific implementation process, the circuit board will reveal the area that needs to thicken the copper through the first pattern transfer, and the electroplating thickens to meet the copper thickness of the line Requirements; liquid photosensitive ink is used as the resist in the second graphic transfer, and the lines in different copper thickness areas are accurately compensated, so that under acidic etching conditions, the line width and line spacing of different copper thickness areas are all 3 / 3mil requirement.

[0062] Production Method:

[0063] (1) Cutting: cut the Taiguang EM825 substrate, and the cutting size is 468*412mm.

[0064] (2) Drilling: Use mechanical drilling to drill holes in the circuit board.

[0065] (3) The first pattern transfer: use a dry film with a model number of DG38 and a thickness of 38 μm, with a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for manufacturing a stepped circuit board, and belongs to the technical field of circuit board production processes. The method for manufacturing the stepped circuit board is characterized by comprising the following steps of (1) board cutting, (2) hole drilling, (2) primary pattern transfer, (4) graph electroplating, (5) film stripping, (6) secondary pattern transfer, (7) etching, (8) film stripping and (9) detection on whether the circuit width and the circuit distance of a circuit reach the standard or not. The method for manufacturing the stepped circuit board is simple in technological process, free of grinding boards, low in manufacturing cost and applicable to manufacturing stepped circuit boards.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, and more specifically, relates to a method for manufacturing a stepped circuit board. Background technique [0002] With the development of printed circuit boards in the direction of "light, thin, short and small", the requirements for circuit design and production methods of electronic products are getting higher and higher. industry requirements. In order to adapt to the development trend of diversification and modularization of electronic products, ladder lines appeared. The characteristic of the ladder line is that there is a difference in the thickness of the copper that constitutes the fine line of the printed circuit board, that is, there is a certain gradient difference between the lines in different regions due to the difference in the copper thickness. [0003] However, it is difficult to prepare stepped circuit boards by using the traditional fine circuit technology. The ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 李晓蔚陈际达张胜涛张翠刘璇刘又畅陈世金邓宏喜徐缓
Owner BOMIN ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com