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A kind of micro reverse extrusion forming die and extrusion forming load test device

A reverse extrusion and die technology, applied in the field of extrusion forming load test device, can solve problems such as difficulty in extrusion forming lubrication, and achieve the effects of simple structure, easy replacement, and reduced manufacturing cost

Inactive Publication Date: 2016-02-10
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, none of the existing laboratory molds can meet the above requirements
Furthermore, due to the small size of the molded parts, it is not only very difficult to lubricate during extrusion, but also prone to micro-size effects

Method used

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  • A kind of micro reverse extrusion forming die and extrusion forming load test device
  • A kind of micro reverse extrusion forming die and extrusion forming load test device
  • A kind of micro reverse extrusion forming die and extrusion forming load test device

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Embodiment Construction

[0023] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0024] figure 1 Shown is a preferred embodiment of a micro-back extrusion molding die according to the present invention. Such as figure 1 As shown, the mold comprises two half-mold devices, each half-mold device includes a mold base and a universal holder detachably fixed on the mold base, wherein the holder is formed with a retaining cavity for clamping a concave An adapter clamp for the mold or punch is detachably fixed in the holding cavity of the holder. When replacing the die or punch, it is only necessary to select a suitable adapter fixture according to the different die or punch, and the holder can continue to be used, thereby reducing the manufacturing cost of th...

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Abstract

The invention belongs to the technical field of micro forming, and in particular relates to a micro backward-extrusion forming mold. The mold comprises two half mold devices, wherein each half mold device comprises a mold frame and a clamping device which is detachably fixed on the mold frame, the clamping device is provided with a clamping device maintaining cavity, and an adaptive clamp which is used for clamping a female die or a male die is detachably fixed in the clamping device maintaining cavity. According to the micro backward-extrusion forming mold, the female die and the male die are clamped by adopting the two clamps, and when the female die and the male die are replaced, only the adaptive clamps need to be replaced, while a maintainer can be used continuously, so that the manufacturing cost of the mold in experiment can be reduced, the female die and the male die are convenient to replace, and the structure is simple. The invention also discloses an extrusion forming load test device comprising the micro backward-extrusion forming mold.

Description

technical field [0001] The invention belongs to the technical field of micro-forming, and in particular relates to a laboratory-used micro-reverse extrusion forming die and an extrusion forming load test device comprising the above-mentioned micro-reverse extrusion forming die. Background technique [0002] Microforming technology is an advanced micro-manufacturing technology that has emerged worldwide in the past ten years, and miniaturization has become one of the trends in manufacturing. Micro-extrusion forming refers to forming parts with two or more dimensions below 1 mm by extrusion processing method. Since the formed parts tend to be miniaturized, high precision and high hardness are proposed for micro-forming molds. , Low friction requirements. In addition, as a micro-extrusion forming die for laboratory use, it is also necessary to facilitate the replacement of concave and convex dies with different diameters, and to collect the load-displacement curves during the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21C25/02G01N3/00
Inventor 李仕成陈泽中魏雅新茹林潺苏曦涂明闫强高强王东峰
Owner UNIV OF SHANGHAI FOR SCI & TECH