Fingerprint identification device and fingerprint identification assembly with mould pressing protection layer

A fingerprint recognition and protective layer technology, applied in character and pattern recognition, instruments, computer parts and other directions, can solve the problems of reducing the efficiency of fingerprint recognition, easy to break, and the service life cannot be guaranteed, so as to improve the user experience, enhance the Sensitivity, the effect of reducing attenuation

Inactive Publication Date: 2014-10-15
SILEAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, due to the limitation of the process of the lens 20, the thickness of the lens 20 is usually more than 200 μm, and the material of the lens 20 is usually relatively brittle. If it is made thinner, it is easy to break and the service life cannot be guaranteed.
The thicker thickness of the lens 20 will also reduce the efficiency of fingerprint recognition

Method used

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  • Fingerprint identification device and fingerprint identification assembly with mould pressing protection layer
  • Fingerprint identification device and fingerprint identification assembly with mould pressing protection layer
  • Fingerprint identification device and fingerprint identification assembly with mould pressing protection layer

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Embodiment Construction

[0033] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific goals, such as changing from one embodiment to another in accordance with system-related or business-related constraints. Additionally, it should be recognized that such a development effort might be complex and time consuming, but would nevertheless be merely a routine undertaking for those skilled in the art.

[0034] In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary ...

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Abstract

The invention relates to the technical field of integrated circuit manufacture and packaging, and discloses a fingerprint identification device and a fingerprint identification assembly with a mould pressing protection layer. In the invention, a mould pressing mode can be adopted to form a thinner protection layer, the protection layer is formed on the surface of a fingerprint identification chip to become one part of the fingerprint identification device without forming a lens for protection subsequently, so that, technical steps are reduced. Since the protection layer formed in the above way can be thin, the attenuation of a fingerprint signal after the fingerprint signal passes through the protection layer is reduced, the sensitivity of the fingerprint identification chip is enhanced, and fingerprint identification efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing and packaging, in particular to a fingerprint identification device and a fingerprint identification component with a molded protective layer. Background technique [0002] With the continuous development of mobile communication technology, smart phones have integrated functions in various fields. For example, you can send and receive emails, play video and audio files, record meeting minutes, and even hold video conferences through your smartphone. In addition, a large amount of data is usually stored in a mobile phone used by an individual. If the mobile phone is lost or stolen, it is likely to cause even greater losses. Existing mobile phones are usually protected by digital passwords or graphic passwords, which are cumbersome to store and easily cracked. Therefore, it is popular to use the fingerprint password as the password protection of the mobile phone nowadays,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/62
Inventor 曾敏程泰松
Owner SILEAD
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