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Method for making embossing on the surface of photovoltaic ribbon

A technology of photovoltaic welding strip and surface fabrication, applied in photovoltaic power generation, metal rolling, final product manufacturing, etc., it can solve the problems that the angle of the V-shaped groove is difficult to meet the design requirements, and the mold is difficult to fit completely, so as to achieve easy separation. , the effect of overcoming surface tension

Active Publication Date: 2016-03-30
WUXI SUNTECH POWER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to keep the surface of the V-shaped groove smooth and the mold to be easily separated from the solder layer, the mold used in the embossing process must not infiltrate the molten solder layer. Fitting, after the solder layer is cooled, the angle of the pressed V-shaped groove is difficult to meet the design requirements

Method used

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  • Method for making embossing on the surface of photovoltaic ribbon
  • Method for making embossing on the surface of photovoltaic ribbon
  • Method for making embossing on the surface of photovoltaic ribbon

Examples

Experimental program
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Effect test

Embodiment 1

[0017] Embodiment 1: a method for making embossing on the surface of a photovoltaic ribbon, comprising the following steps:

[0018] (1) Heating to melt the solder layer on the surface of the photovoltaic ribbon, the heating temperature is 160°C, and the heating time is 5 seconds;

[0019] (2) Put the embossing mold in contact with the molten solder layer, apply pressure to make the embossing mold fully contact with the molten solder layer, apply positive pressure, and the pressure is 1.01×10 4 Pa; said positive pressure refers to the pressure added by the edge of the contact surface of the mold and the solder layer;

[0020] (3) Keep the molten solder layer in full contact with the embossing mold under pressure, hold the pressure for 1 second, and cool the molten solder layer to room temperature;

[0021] (4) Remove the embossing mold to form a V-shaped groove on the surface of the molten solder layer that meets the design requirements.

Embodiment 2

[0022] Embodiment 2: A method for making embossing on the surface of a photovoltaic ribbon, comprising the following steps:

[0023] (1) Heating to melt the solder layer on the surface of the photovoltaic ribbon, the heating temperature is 400°C, and the heating time is 1 second;

[0024] (2) Put the embossing mold in contact with the molten solder layer, apply pressure to make the embossing mold fully contact with the molten solder layer, and apply negative pressure, the pressure is 1.01×10 6 Pa; said negative pressure refers to that the contact surface of mold and solder layer is sucked to generate negative pressure;

[0025] (3) Keep the molten solder layer in full contact with the embossing mold under pressure, hold the pressure for 10 seconds, and cool the molten solder layer to room temperature;

[0026] (4) Remove the embossing mold to form a V-shaped groove on the surface of the molten solder layer that meets the design requirements.

Embodiment 3

[0027] Embodiment three: a method for making embossing on the surface of a photovoltaic ribbon, comprising the following steps:

[0028] (1) Heating to melt the solder layer on the surface of the photovoltaic ribbon, the heating temperature is 200°C, and the heating time is 2 seconds;

[0029] (2) Put the embossing mold in contact with the molten solder layer, apply pressure to make the embossing mold fully contact with the molten solder layer, and apply negative pressure, the pressure is 1.01×10 5 Pa; said negative pressure refers to that the contact surface of mold and solder layer is sucked to generate negative pressure;

[0030] (3) Keep the molten solder layer in full contact with the embossing mold under pressure, hold the pressure for 5 seconds, and cool the molten solder layer to room temperature;

[0031] (4) Remove the embossing mold to form a V-shaped groove on the surface of the molten solder layer that meets the design requirements.

[0032] The invention can ke...

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Abstract

The invention relates to a method for embossing the surface of a photovoltaic welding strip. The method is characterized by comprising the following steps that (1) a soldering layer on the surface of the photovoltaic welding strip melts by being heated; (2) an embossing mold makes contact with the molten soldering layer, and the embossing mold makes complete contact with the molten soldering layer through positive pressure or negative pressure, wherein the pressure ranges from 1.01*104 Pa to 1.01*106 Pa, the positive pressure indicates that air pressure is added to the edges of the contact face of the mold and the soldering layer in a spiral mode, and the negative pressure indicates that suction is carried out on the contact face of the mold and the soldering layer so as to generate the negative pressure; (3) it is ensured that the molten soldering layer and the embossing mold make complete contact under the situation of pressurization, and after the pressure is maintained, the molten soldering layer is cooled to be at the indoor temperature; (4) the embossing mold is removed. The action of surface tension of the molten soldering layer can be overcome, infiltration between the mold and the molten soldering layer is avoided in the embossing process, it is ensured that the mold is completely attached to the soldering layer, and after the soldering layer is cooled, the angle of a V-shaped groove obtained by pressing meets the design requirement.

Description

technical field [0001] The invention relates to a method for making embossing on the surface of a photovoltaic ribbon, and belongs to the technical field of crystalline silicon photovoltaic module production. Background technique [0002] When conventional crystalline silicon solar cells are packaged into photovoltaic modules, photovoltaic ribbons are usually used to weld and connect solar cells in series. The existing conventional photovoltaic ribbons are metal substrates such as copper strips in the middle and solder layers on the surface. The surface of the welding device in contact with the tin alloy of the ribbon is flat, resulting in a smoother surface of the photovoltaic ribbon after welding, and most of the light incident on it (referred to as incident light) is directly reflected out of the photovoltaic module, such as figure 1 As shown, the resulting radiation loss accounts for about 3% of the total radiation received by the photovoltaic module. In the prior art, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21H7/14H01L31/05H01L31/18
CPCY02E10/50Y02P70/50
Inventor 朱景兵梁哲
Owner WUXI SUNTECH POWER CO LTD