Method for making embossing on the surface of photovoltaic ribbon
A technology of photovoltaic welding strip and surface fabrication, applied in photovoltaic power generation, metal rolling, final product manufacturing, etc., it can solve the problems that the angle of the V-shaped groove is difficult to meet the design requirements, and the mold is difficult to fit completely, so as to achieve easy separation. , the effect of overcoming surface tension
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Embodiment 1
[0017] Embodiment 1: a method for making embossing on the surface of a photovoltaic ribbon, comprising the following steps:
[0018] (1) Heating to melt the solder layer on the surface of the photovoltaic ribbon, the heating temperature is 160°C, and the heating time is 5 seconds;
[0019] (2) Put the embossing mold in contact with the molten solder layer, apply pressure to make the embossing mold fully contact with the molten solder layer, apply positive pressure, and the pressure is 1.01×10 4 Pa; said positive pressure refers to the pressure added by the edge of the contact surface of the mold and the solder layer;
[0020] (3) Keep the molten solder layer in full contact with the embossing mold under pressure, hold the pressure for 1 second, and cool the molten solder layer to room temperature;
[0021] (4) Remove the embossing mold to form a V-shaped groove on the surface of the molten solder layer that meets the design requirements.
Embodiment 2
[0022] Embodiment 2: A method for making embossing on the surface of a photovoltaic ribbon, comprising the following steps:
[0023] (1) Heating to melt the solder layer on the surface of the photovoltaic ribbon, the heating temperature is 400°C, and the heating time is 1 second;
[0024] (2) Put the embossing mold in contact with the molten solder layer, apply pressure to make the embossing mold fully contact with the molten solder layer, and apply negative pressure, the pressure is 1.01×10 6 Pa; said negative pressure refers to that the contact surface of mold and solder layer is sucked to generate negative pressure;
[0025] (3) Keep the molten solder layer in full contact with the embossing mold under pressure, hold the pressure for 10 seconds, and cool the molten solder layer to room temperature;
[0026] (4) Remove the embossing mold to form a V-shaped groove on the surface of the molten solder layer that meets the design requirements.
Embodiment 3
[0027] Embodiment three: a method for making embossing on the surface of a photovoltaic ribbon, comprising the following steps:
[0028] (1) Heating to melt the solder layer on the surface of the photovoltaic ribbon, the heating temperature is 200°C, and the heating time is 2 seconds;
[0029] (2) Put the embossing mold in contact with the molten solder layer, apply pressure to make the embossing mold fully contact with the molten solder layer, and apply negative pressure, the pressure is 1.01×10 5 Pa; said negative pressure refers to that the contact surface of mold and solder layer is sucked to generate negative pressure;
[0030] (3) Keep the molten solder layer in full contact with the embossing mold under pressure, hold the pressure for 5 seconds, and cool the molten solder layer to room temperature;
[0031] (4) Remove the embossing mold to form a V-shaped groove on the surface of the molten solder layer that meets the design requirements.
[0032] The invention can ke...
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