Vinyl chloride adhesive sheets and tapes

Abstract

The invention provides a vinyl chloride series adhesive sheet and an adhesive tape, which are little influenced by the temperature of a service environment and are prepared by using vinyl chloride series film as a substrate. With the exudation of a non-lead series stabilizing agent and a plasticizer, adhesive performance of the vinyl chloride series adhesive sheet and the adhesive tape is reduced little. The vinyl chloride series adhesive sheet and the adhesive tape are characterized in that one surface of the substrate has an adhesive layer; one surface of the substrate, opposite to the surface with the adhesive layer, has a back processing layer which is a mixed layer of polysiloxane and a (methyl) acrylic polymer; the mass ratio of polysiloxane to the (methyl) acrylic polymer is 1:5-5:1; the substrate contains PVC resin, a copolymer of metacrylic acid ester, styrene and butadiene, a stabilizing agent and a plasticizer; the adhesive layer is a (methyl)acrylic polymer; and in the vinyl chloride series adhesive sheet and the adhesive tape, static friction coefficient of the back processing layer is 0.05-1.0.

Description

technical field [0001] The present invention relates to vinyl chloride-based adhesive sheets and tapes used for surface protection of metal plates and for semiconductor wafer manufacturing processes. Background technique [0002] Adhesive sheets and tapes conventionally used for the surface protection of metal plates and for semiconductor wafer manufacturing processes generally use an acrylic adhesive etc. Adhesive sheets and tapes made of an adhesive layer of about 100 μm. [0003] However, polyvinyl chloride (PVC), which is the raw material of the above-mentioned soft vinyl chloride film substrate, may change color due to chemical reactions caused by physical energy such as heat, ultraviolet rays, and shearing force, or may develop physical and mechanical properties. Or deterioration of electrical characteristics, etc. Therefore, in the manufacture of soft vinyl chloride film substrates (typically, calendering using calender rolls), in order to prevent or suppress the ch...

AI Technical Summary

Problems solved by technology

[0004] In addition, for vinyl chloride-based film substrates, in order to maintain the flexibility of polyvinyl chloride, it is controlled with a liquid plasticizer, but it is difficult to control the amount of plasticizer according to the use environment. For example, there are problems such as: It becomes soft in the high temperature of summer, and becomes too hard in the low temperature of winter

[0005] In addition, non-lead-based stabilizers and plasticizers bleed from the vinyl chloride-based film substrate to the adhesive side over time, adversely affecting the adhesive properties of the adhesive. For example, in metal plate protection applications, adhesive sheets and The tape peels off from the metal plate, and the surface protection of the metal plate cannot be achieved

[0006] For semiconductor wafers, there are problems that chips fly when dicing semiconductor wafers, chips fly when expanding, or the gap between chips is not uniform due to a decrease in adhesion characteristics

[0008] Vinyl chloride-based film substrates that usually contain plasticizers have a high friction coefficient, and the vinyl chloride-based film substrates are broken due to the high friction coefficient during the processing of metal plates; Uneven gap between chips

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