Cooling system for molded modules and corresponding manufacturing method

Abstract

A cooling system for a molded module and corresponding manufacturing method. A cooling system for a molded module includes a plurality of individual modules each including a semiconductor die encapsulated by a molding compound, a plurality of leads electrically connected to the semiconductor die and at least partially uncovered by the molding compound, and at least partially Cooling plate not covered by molding compound. A molded body forms a multi-die module around the periphery of each individual module. The leads and cooling plate of each individual module are at least partially uncovered by the molded body. A cover with ports is attached to the periphery of the molded body at the first side of the multi-die module. The cover closes the multi-die module at a first side to form a cavity between the cover and the molded body to allow fluid exiting or entering the ports to contact the cooling plate of each individual module.

Description

technical field [0001] This application relates to power modules, and more particularly to cooling systems for power modules. Background technique [0002] A power module with double-sided cooling significantly improves the thermal performance of the package by reducing the thermal resistance and thus increasing the power density of the overall system. However, power modules with double-sided cooling present challenges regarding the integration of the heat sink with the module. Cooler design is often a critical issue in achieving the highest possible performance. For example, cooling fluid should be distributed in two different passages above and below a power module included in the package to increase the thermal performance of the package. Also, the entire system must be watertight. The heat sink should be robust, low cost and lightweight. [0003] Conventional double-sided module cooling techniques require additional parts such as O-rings and bolts or screws to achiev...

AI Technical Summary

Problems solved by technology

These additional parts add weight and cost to the system and still present a real risk of fluid leakage

Additionally, the need for many assembly steps increases production costs

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