System and method for inspecting wire bonding

Abstract

A system and method for inspecting wire bonding is provided. The system includes: a camera for photographing a substrate on which a semiconductor chip is mounted; an image processor for detecting an inspection target lead part from an image of the substrate photographed by the camera; a memory for storing reference data, the reference data is a standard for determining whether the detected inspection target lead part is normally connected; and a normal state determiner for determining whether the lead is normally connected by using the angle of the inspection target lead part and the reference data. The system may further include: a camera driver for adjusting the height of the camera; and a controller for controlling the camera driver to take a plurality of images of the substrate while changing the height of the camera. Therefore, it is possible to determine whether the wire is normally bonded by using the wire bonding direction in the 2D image, and thus the accuracy of the wire bonding inspection can be improved and the processing thereof can be simplified.

Description

technical field [0001] The present invention relates to a system and method for inspecting wire bonding, and more particularly, to whether a wire is normally bonded can be determined by using a wire bonding direction in a 2-dimensional image, and thus the accuracy of wire bonding inspection can be improved and A system and method for inspecting wire bonding that simplifies its handling. Background technique [0002] In general, a substrate on which a semiconductor chip including pads formed on a wafer serving as input / output terminals is used in electronic components, and the thus manufactured semiconductor chip is mounted on the substrate. [0003] The process of mounting the semiconductor chip includes a process of individualizing the semiconductor chip, a process of bonding the individualized semiconductor chip to a substrate, a process of connecting the semiconductor chip and the substrate via conductive leads, and a process of molding the semiconductor chip. [0004] T...

AI Technical Summary

Problems solved by technology

However, since there are various parts between the pads of the semiconductor chip and the lands on the substrate, it may be difficult to distinguish the various parts and leads on the captured image

In this case, since the precise connection status of the lead wires cannot be acquired, there may be an error in the inspection result

In addition, the image may be distorted depending on the illuminance of the lighting device and the lighting position, and an error may occur in the detection result depending on the skill of the inspection program operator or the work environment

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