Low-thermal-resistance low-cost automobile solid-state relay

A solid-state relay, low-cost technology, used in relay ventilation/cooling/heating, relay base/shell/cover, etc., can solve the problems of high cost of heat dissipation materials, small current capacity, poor heat dissipation capacity of solid state relays, etc. Heat dissipation effect, rapid heat dissipation effect

Inactive Publication Date: 2014-11-19
厦门宏发交通电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the automotive solid-state relay still has defects such as poor heat dissipation, small current capacity, large loss, low reliability, high cost of heat dissipation materials, and complicated welding process of output pins. In view of this, this case arises

Method used

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  • Low-thermal-resistance low-cost automobile solid-state relay
  • Low-thermal-resistance low-cost automobile solid-state relay
  • Low-thermal-resistance low-cost automobile solid-state relay

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Embodiment Construction

[0045] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0046] refer to Figures 1 to 13b As shown, a low thermal resistance and low cost vehicle solid state relay disclosed by the present invention includes a circuit board 1 with electrical connection terminals 11 and a heat dissipation case 2 with a cavity 21 .

[0047] The circuit board 1 is sealed and installed in the cavity 21 of the heat dissipation shell 2. In this embodiment, as Figure 9 and Figure 10 As shown, a step 22 is formed on the side walls around the cavity 21 of the heat dissipation housing 2, and a gap is formed between the step 22 and the bottom of the cavity 21, as Figure 11 As shown, the thermally conductive insulating glue 3 fills the gap, and seals and fixes the circuit board 1 at the bottom of the cavity 21 . The installation structure of the circuit board 1 makes the installation of the circuit board 1 relatively sta...

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PUM

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Abstract

The invention discloses a low-thermal-resistance low-cost automobile solid-state relay, which comprises a circuit board with electrical connection terminals and a heat dissipation casing with a cavity, wherein the circuit board is hermetically mounted in the cavity of the heat dissipation casing and is composed of an upper circuit layer, a middle insulating layer and a lower circuit layer; a plurality of heat-conduction through holes are formed in the middle insulating layer. The low-thermal-resistance low-cost automobile solid-state relay disclosed by the invention has the advantages that the heat dissipation effect is improved, and the material cost is relatively low.

Description

technical field [0001] The invention relates to the technical field of solid-state relays for vehicles, in particular to a solid-state relay for vehicles with low thermal resistance and low cost. Background technique [0002] The working principle of automotive relays is to use low current (low power) control signals to control high current (high power) on and off. In the prior art, the traditional relay is an electromagnetic relay, which uses magnetic force to complete small signal control of large current, and its mechanical action switch structure affects the service life, weight and operating noise of the electromagnetic relay. [0003] The electromagnetic relay is a mechanical switch, and it is easy to cause deformation of components in the internal structure of the relay when the car is over-impacted such as emergency stop, emergency start and other states. After the component is deformed, the relay can no longer realize the basic on-off function. Moreover, the coil ...

Claims

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Application Information

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IPC IPC(8): H01H45/12H01H45/02
Inventor 傅华盛
Owner 厦门宏发交通电器有限公司
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