A kind of manufacturing method of double-sided copper flexible circuit board

Abstract

The invention provides a manufacturing method for a two-sided copper flexible circuit board. The manufacturing method at least comprises the following steps: step 1, providing a polyimide base membrane, on the first surface of which, copper foil is formed, and forming a peelable mask pattern on the second surface of the base membrane, wherein the area, which is not covered by the peelable mask pattern, on the second surface of the base membrane constitutes a copper circuit figure; step 2, sputtering copper on the second surface of the base membrane, so as to form a copper membrane on the peelable mask pattern and the copper circuit on the copper circuit figure; step 3, tearing off the copper membrane on the peelable mask pattern and manufacturing to obtain the two-sided copper flexible circuit board. The manufacturing method has the advantages as follows: the ultrathin two-sided copper flexible circuit board can be manufactured, the process is simple, the 20-30% of production cost can be reduced, the manufacturing of the copper circuit is based on an addition process, waste emission is reduced, and environmental pollution is reduced; meanwhile, the torn copper membrane can be recycled after being cleaned simply, and material waste can be reduced.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and relates to a method for manufacturing double-sided copper flexible circuit boards. Background technique [0002] The production of laminated copper method is a development topic proposed by Atotech abroad. At present, HDI electroplating technology is mostly based on horizontal copper wires, which requires expensive equipment. It comes from Atotech in Germany and is the main equipment. manufacturer. The build-up method is one of the methods for making multi-layer printed circuit boards. The outer layer is wrapped after the inner layer is made, and then the outer layer is processed by subtraction or addition. Continuously repeating the actions of the lamination method to obtain multi-layer multilayer printed circuit boards is the sequential lamination method. [0003] Flexible Printed Circuit (FPC) has the advantages of softness, thinness and flexibility. Under the trend of information e...

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Problems solved by technology

[0009] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for manufacturing double-sided copper flexible circuit boards, which is used to solve the problem of complex process and high cost of making ultra-thin copper flexible circuit boards in the prior art. , Difficulty in mass production

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