Manufacturing method for two-sided copper flexible circuit board

A flexible circuit board and manufacturing method technology, which is applied in the direction of removing conductive materials by mechanical methods, can solve the problems of difficult mass production, high cost, and complex process of ultra-thin copper flexible circuit boards, so as to reduce environmental pressure, The effect of good application performance, increased service life and application range
CN104159408AActive Publication Date: 2014-11-19上海蓝沛信泰光电科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
上海蓝沛信泰光电科技有限公司
Publication Date
2014-11-19

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Abstract

The invention provides a manufacturing method for a two-sided copper flexible circuit board. The manufacturing method at least comprises the following steps: step 1, providing a polyimide base membrane, on the first surface of which, copper foil is formed, and forming a peelable mask pattern on the second surface of the base membrane, wherein the area, which is not covered by the peelable mask pattern, on the second surface of the base membrane constitutes a copper circuit figure; step 2, sputtering copper on the second surface of the base membrane, so as to form a copper membrane on the peelable mask pattern and the copper circuit on the copper circuit figure; step 3, tearing off the copper membrane on the peelable mask pattern and manufacturing to obtain the two-sided copper flexible circuit board. The manufacturing method has the advantages as follows: the ultrathin two-sided copper flexible circuit board can be manufactured, the process is simple, the 20-30% of production cost can be reduced, the manufacturing of the copper circuit is based on an addition process, waste emission is reduced, and environmental pollution is reduced; meanwhile, the torn copper membrane can be recycled after being cleaned simply, and material waste can be reduced.
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Description

Technical field

[0001] The invention belongs to the field of printed circuit boards and relates to a method for manufacturing a double-sided copper flexible circuit board. Background technique

[0002] The production of laminated copper method was a development topic put forward by Atotech abroad. At present, most of the HDI electroplating technology is based on horizontal one copper wire, which requires expensive equipment. It comes from Atotech in Germany and is the main equipment. manufacturer. The build-up method is one of the methods for making multilayer printed circuit boards. The outer layer is covered after the inner layer is made, and then the outer layer is processed by subtractive or additive methods. The operation of the build-up method is repeated continuously to obtain a multilayer printed circuit board with multiple layers, which is the sequential build-up method.

[0003] Flexible printed circuit (Flexible Printed Circuit, FPC) has the advantages of softness, lig...

Claims

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