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Processing method for package substrate with cavity structure

A technology for packaging substrates and processing methods, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reduced reliability, complicated manufacturing process, and high cost, so as to reduce processing costs, simplify the process, and improve reliability effect

Active Publication Date: 2014-11-26
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] During the research and practice of the prior art, the inventors of the present invention found that in the above-mentioned manufacturing process, it is easy to reduce the reliability due to the unclean removal of the coated protective material, and the manufacturing process is complicated. higher cost

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  • Processing method for package substrate with cavity structure
  • Processing method for package substrate with cavity structure
  • Processing method for package substrate with cavity structure

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Embodiment 1

[0019] Please refer to figure 2 , an embodiment of the present invention provides a method for processing a packaging substrate with a cavity structure, including:

[0020] 110. Fabricate a multilayer substrate, where a cavity is formed on the multilayer substrate, and the bottom of the cavity is provided with a metal layer.

[0021] In this step, the bottom of the concave cavity formed on the multilayer substrate should at least reach the sub-outer circuit pattern of the multilayer substrate. In one embodiment, after the inner copper foil layer is processed into an inner layer circuit pattern, the outer insulating layer and the outer copper foil layer are sequentially laminated on the inner layer circuit pattern to make a multilayer substrate; It is mentioned that a concave cavity whose bottom reaches the inner circuit pattern is processed on the outer insulating layer and the outer copper foil layer. In another embodiment, after the inner copper foil layer can be processe...

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Abstract

The invention discloses a processing method for a package substrate with a cavity structure. The method comprises the following steps: preparing a multilayer substrate, a cavity being formed in the multilayer substrate, and the bottom portion of the cavity being provided with a metal layer; pasting a photosensitive dry film onto an outer copper foil layer of the multilayer substrate by utilizing a vacuum film-pasting process, and enabling the photosensitive dry film at the cavity portion to be closely fit with the metal layer at the bottom portion of the cavity; transferring circuit patterns onto the outer copper foil layer of the multilayer substrate and the metal layer at the bottom portion of the cavity through an exposure and developing step; and processing the outer copper foil layer of the multilayer substrate and the metal layer at the bottom portion of the cavity into a circuit pattern through an etching step. According to the technical scheme in the invention, by forming the cavity first, then, pasting the photosensitive dry film onto the bottom portion of the cavity by utilizing the vacuum film-pasting process, and forming the circuit pattern at the bottom portion of the cavity through the outer image step, the problem of damaging the inner layer circuit pattern in the cavity processing process is prevented, and the reliability of the package substrate is improved; and the technological process is simplified through the technical scheme, and the process cost is reduced.

Description

technical field [0001] The invention relates to the technical field of packaging substrate processing, in particular to a processing method for a packaging substrate with a cavity structure. Background technique [0002] figure 1 Shown is a schematic diagram of a packaging substrate with a cavity (Cavity) structure. The concave cavity is a concave stepped structure formed in the package substrate by controlled depth milling. The concave part can be used to embed chipsets and other components, and the bottom of the cavity is processed with a circuit pattern for connecting the chipset. The advantage of this structure packaging substrate is that the surface of the packaging substrate can still be kept flat even after the chipset is embedded, which can increase the effective usable area of ​​the packaging substrate and facilitate assembly and protection of the chipset. [0003] In the prior art, the manufacturing process of the circuit pattern at the bottom of the concave cavi...

Claims

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Application Information

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IPC IPC(8): H01L21/48
CPCH01L21/4846
Inventor 高成志赵增源
Owner SHENNAN CIRCUITS
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