Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Synthesis method of silicone resin with core-shell structure for LED packaging

A technology of LED packaging and core-shell structure, which is applied in the field of synthesis of silicone resin, can solve the problems of poor resistance to cold and heat shocks, and achieve the effects of improving toughness, good reproducibility and controllability, and facilitating large-scale production

Active Publication Date: 2017-05-31
SHENZHEN MINGYUE TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of poor cold and heat shock resistance of high refractive index silicone resin used in current LED packaging materials, develop a high refractive index and high and low temperature resistant core-shell structure silicone resin, and provide a kind of LED packaging material. Synthesis method of silicone resin with core-shell structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Synthesis method of silicone resin with core-shell structure for LED packaging
  • Synthesis method of silicone resin with core-shell structure for LED packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] First, weigh 41.6g (0.2mol) tetraethoxysilane and 60g ethanol in sequence, mix them evenly, and pour them into a 500ml four-neck flask with cooling, stirring and heating devices; then, slowly drop them at 25°C Add 49.5g of hydrochloric acid aqueous solution with PH=1, and continue to react for 1h after the dropwise addition; 18g (0.15mol) of dimethyldimethoxysilane monomer mixture, after the dropwise addition, the temperature was raised to 60°C for 6 hours; then 18.6g (0.1mol) of divinyltetramethyldisiloxane was added to the system to continue React for 10 hours; finally, add about 100g of toluene and let it stand, separate layers, wash until neutral, and distill under reduced pressure to obtain 137.5g of colorless and transparent silicone resin with a refractive index of 1.535, a viscosity of 36850mPaS, and a vinyl content of 3.7%. The rate is 94.0%.

Embodiment 2

[0021] First, weigh 20.8g (0.1mol) tetraethoxysilane and 60g ethanol in sequence, mix them evenly, and pour them into a 500ml four-neck flask equipped with cooling, stirring and heating devices; then, slowly drop them at 25°C Add 47.7g of hydrochloric acid aqueous solution with PH=1, and continue to react for 1h after the dropwise addition; 19.8g (0.15mol) of methylvinyldioxysilane monomer mixture, after the dropwise addition, the temperature was raised to 60°C for 6 hours; then 16.2g (0.1mol) of hexamethyldisiloxane was added to the system to continue the reaction for 10 hours ; Finally, add about 100g toluene and let stand, separate layers, wash to neutrality, and distill under reduced pressure to obtain 140.3g colorless and transparent silicone resin, the refractive index is 1.547, the viscosity is 29370mPaS, the vinyl content is 2.6%, and the yield is 91.9%.

Embodiment 3

[0023] First, weigh 20.8g (0.1mol) tetraethoxysilane and 60g ethanol in sequence, mix them evenly, and pour them into a 500ml four-neck flask equipped with cooling, stirring and heating devices; then, slowly drop them at 25°C Add 44.1g of hydrochloric acid aqueous solution with PH=1, and continue to react for 1h after the dropwise addition; 19.8g (0.15mol) of methylvinyldioxysilane monomer mixture, after the dropwise addition, the temperature was raised to 60°C for 6 hours; then 18.6g (0.1mol) of divinyltetramethyldisiloxane was added to the system Continue the reaction for 10 hours; finally, add about 100g of toluene and let it stand, separate layers, wash until neutral, and distill under reduced pressure to obtain 132.6g of colorless and transparent silicone resin with a refractive index of 1.537, a viscosity of 21690mPaS, and a vinyl content of 6.6%. The yield was 93.3%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
refractive indexaaaaaaaaaa
refractive indexaaaaaaaaaa
refractive indexaaaaaaaaaa
Login to View More

Abstract

The invention discloses a synthetic method of organic silicon resin with core-shell structure for LED (light-emitting diode) encapsulating. The synthetic method comprises the following steps: firstly, by taking tetra-functional siloxane or chlorosilane as a monomer, carrying out hydrolytic polycondensation reaction for 0.5-2 hours at 0-80 DEG C under the effects of a catalyst and a solvent to prepare an inorganic nano core; then, based on that, adding a bifunctional and trifunctional siloxane or chlorosilane monomer mixture to further react for 2-6 hours at 25-80 DEG C, grafting a flexible organic silicon chain section on the outer layer of the inorganic core; and finally, introducing the siloxane with a single functional group, encapsulating and functionalizing the outer layer at 25-120 DEG C, and filtering and purifying under reduced pressure. The organic silicon resin with the core-shell structure provided by the invention not only has high mechanical strength and thermal stability, but also can be used for obviously improving the toughness of the materials and the hot and cold impact resistance under a high-low-temperature circulating condition, and improving the reliability of the LED encapsulating material. And moreover, the process conditions are simple, the repeatability and the controllability are good, and the large-scale production can be conveniently carried out.

Description

technical field [0001] The invention discloses a method for synthesizing an organic silicon resin, in particular to a method for synthesizing an organic silicon resin with a core-shell structure for LED packaging. Background technique [0002] A light emitting diode (Light Emitting Diode, referred to as LED) is a solid-state semiconductor device that directly converts electrical energy into light energy. Due to low working voltage, fast response, long service life, high efficiency, energy saving, green environmental protection and other remarkable features, it has been widely used in signal indication, display screen, automobile, landscape lighting and other fields, and is known as the most potential development in the 21st century. Green lighting source. Especially in today's shortage of resources and energy shortage, LED, as a new type of lighting product, is bound to be the trend of future development, and has become a "commanding height" of an emerging industry that the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/44C08G77/38C08G77/08
Inventor 刘展张保坦
Owner SHENZHEN MINGYUE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com