Hafnium oxide luminescent film, preparing method thereof and electroluminescent device
A light-emitting film, hafnium dioxide technology, applied in electroluminescent light sources, chemical instruments and methods, luminescent materials, etc., can solve problems such as unreported research
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Embodiment 1
[0029] The substrate is ITO glass purchased by CSG, and it is ultrasonically cleaned with toluene, acetone and ethanol for 5 minutes, then rinsed with distilled water, air-dried with nitrogen, and sent to the reaction chamber of the equipment. Use a mechanical pump and a molecular pump to evacuate the vacuum of the chamber to 4.0×10 -3 Pa; Then the substrate is heat-treated at 700°C for 20 minutes, and then the temperature is lowered to 500°C. Turn on the rotating motor, adjust the rotating speed of the substrate support to 300 rpm, and pass in hafnium dicarbonyl Hf(CO) 2 and tris(2,2,6,6-tetramethyl-3,5-heptanedionate) cerium source (DPM) 3 The carrier gas of Ce is Ar gas, the flow rate is 10 sccm, the molar flow ratio is 0.97:0.03, oxygen is introduced, the flow rate is 120 sccm, and the volume ratio of reaction gas to argon is 0.0045:1, and the film deposition starts. The thickness of the film is deposited to 150nm, close the organic source and carrier gas, continue to pa...
Embodiment 2
[0032] The substrate is ITO glass purchased by CSG, and it is ultrasonically cleaned with toluene, acetone and ethanol for 5 minutes, then rinsed with distilled water, air-dried with nitrogen, and sent to the reaction chamber of the equipment. Use a mechanical pump and a molecular pump to evacuate the vacuum of the chamber to 1.0×10 -3 Pa; Then the substrate is heat-treated at 700°C for 10 minutes, and then the temperature is lowered to 250°C. Turn on the rotating motor, adjust the rotating speed of the substrate support to 50 rpm, and pass in hafnium dicarbonyl Hf(CO) 2 and tris(2,2,6,6-tetramethyl-3,5-heptanedionate) cerium source (DPM) 3 The carrier gas of Ce is Ar gas, the flow rate is 10 sccm. The molar flow ratio is 0.94:0.06, oxygen gas is introduced, the flow rate is 10 sccm, and the volume ratio of the reaction gas to argon is 0.0001:1, and the film deposition starts. The thickness of the film is deposited to 80nm, close the organic source and carrier gas, continue...
Embodiment 3
[0034] The substrate is ITO glass purchased by CSG, and it is ultrasonically cleaned with toluene, acetone and ethanol for 5 minutes, then rinsed with distilled water, air-dried with nitrogen, and sent to the reaction chamber of the equipment. Use a mechanical pump and a molecular pump to evacuate the vacuum of the chamber to 1.0×10 -2 Pa; Then the substrate is heat-treated at 700°C for 30 minutes, and then the temperature is lowered to 650°C. Turn on the rotating motor, adjust the rotating speed of the substrate support to 1000 rpm, and pass in hafnium dicarbonyl Hf(CO) 2 and tris(2,2,6,6-tetramethyl-3,5-heptanedionate) cerium source (DPM) 3 The carrier gas of Ce is Ar gas, the flow rate is 10 sccm. The molar flow ratio is 0.99:0.01, and oxygen gas is introduced at a flow rate of 200 sccm, wherein the volume ratio of the reaction gas to argon is 0.001:1, and the film deposition starts. The thickness of the film is deposited to 300nm, close the organic source and carrier ga...
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