The invention belongs to the technical field of LED manufacturing, particularly relates to a UVB LED
chip and a preparation method, and aims to improve the light
transmittance of the UVB LED
chip. The UVB LED
chip comprises a substrate, an antireflection film, a filtering film, an N-type
semiconductor layer, an
active layer and a P-type
semiconductor layer. The antireflection film is located on the surface of one side of the substrate, the filtering film is located on the side, away from the substrate, of the antireflection film, the N-type
semiconductor layer is located on the side, away from the substrate, of the filtering film, the
active layer is located on the side, away from the substrate, of the N-type semiconductor layer, and the P-type semiconductor layer is located on the side, away from the substrate, of the
active layer. Wherein the material of the anti-reflection film comprises at least one of
magnesium fluoride,
aluminum fluoride and aluminum
oxide, the thickness of the anti-reflection film is
lambda / 4n,
lambda is the target
wavelength of the anti-reflection film, and n is the material
refractive index of the anti-reflection film. The filtering film is a single-layer or multi-layer interference filtering film, and the material of the filtering film comprises at least one of
titanium oxide,
hafnium oxide, aluminum oxide,
silicon dioxide and
aluminum fluoride.