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74results about How to "Enhanced infrared absorption" patented technology

Differential-output infrared detector unit structure and manufacturing method

The invention discloses a differential-output infrared detector unit structure and a manufacturing method. According to the differential-output infrared detector unit structure and the manufacturing method, based on the negative sensitive material layer structure of an existing pixel which has a negative temperature coefficient, a positive sensitive material layer with a positive temperature coefficient is additionally adopted, so that a double-layer composite structure of an infrared pixel can be formed, and therefore, with the area of the pixel not increased, the infrared absorption effect of an MEMS infrared detector can be improved, and the sensitivity of the MEMS infrared detector can be the improved; the negative sensitive material layer and the positive sensitive material layer are respectively provided with two metal supporting column structures; a micro bridge structure is fixed to the metal supporting column structures through an insulating isolation layer, and therefore, the mechanical strength and stability of the micro bridge structure can be effectively enhanced; and a peripheral readout circuit is provided with a differential sensitive amplifier circuit, so that noises generated by some parasitic effects in the infrared detector unit structures can be eliminated, and therefore, high-sensitivity and low-noise MEMS infrared detectors can be obtained.
Owner:SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT

Building cylinder arrangement for a machine for the layer-by-layer production of three-dimensional objects

A building cylinder arrangement (1) for a machine (70) for the layer-by-layer production of three-dimensional objects (71) by laser sintering or laser melting of powdered material (74), with a substantially cylindrical shell-shaped main body (2) and a piston (4) that can move on an inner side of the main body (2) along a cylinder axis (3) of the main body (2), wherein the piston (4) has on its upper side a substrate (21) for the growing of the three-dimensional objects (71), is characterized in that the main body (2) comprises a substantially cylindrical shell-shaped insulating body (5), whichforms at least the inner side of the main body (2), wherein the insulating body (5) consists of a material with a specific thermal conductivity Lamuda IK, where Lamuda IK is equal to or smaller thans 3 W/(m*K), in that the piston (4) is formed with an upper part (12) and a lower part (14), wherein the upper part (12) comprises the substrate (21), and wherein the lower part (14) has a cooling device (18), in particular a system of cooling water channels, and in that a first seal (20) of elastomer material is provided on the lower part (14) and is used to provide a gas-tight seal for the lowerpart (14) of the piston (4) with respect to the inner side of the main body (2). The invention proposes a building cylinder arrangement with which improved gas-tight sealing between the piston and the main body can be achieved even at high temperatures (for instance above 500 degrees).
Owner:TRUMPF LASERSYST FOR SEMICON MFG

Method for manufacturing uncooled infrared focal plane array pixel with silicon-germanium film

ActiveCN103730535AHigh TCR valueLow intrinsic noiseFinal product manufactureRadiation controlled devicesCMOSSilicon nitride
The invention discloses a method for manufacturing an uncooled infrared focal plane array pixel with a silicon-germanium film. The method includes the steps of transferring the silicon-germanium film to a CMOS wafer from an SOI wafer, etching the silicon-germanium film to form a channel, forming a metal top electrode with a lift-off method, etching the silicon-germanium film to form a sensitive block, depositing a silicon nitride supporting film with a PECVD method, carrying out electroplating to grow metal electrode columns, sputtering TiW to form a circuit, sputtering an infrared absorption layer, etching a silicon nitride layer, a TiW layer and the like, forming an L-shaped cantilever beam and the like. According to the method, silicon-germanium/silicon quantum well materials are successfully applied to the field of micrometering bolometers, and the range of sensitive materials capable of being used for making an uncooled infrared focal plane is expanded; it is considered that the silicon-germanium/silicon quantum well materials are three-dimensional electric conducting materials, a U-shaped loop is formed in the mode of etching the channel, and the resistance of the sensitive area is improved; the silicon nitrogen film is introduced, a lambda/4 resonance infrared absorption cavity is formed in the sensitive area, the size of the infrared absorption cavity is accurately controlled, and the infrared absorption rate is effectively improved.
Owner:NANJING UNIV OF SCI & TECH

Self-testing MEMS thermopile infrared detector

The invention provides a self-test MEMS thermopile infrared detector. The detector comprises a substrate and a supporting layer stacked on a surface of the substrate, a thermopile assembly and an infrared absorption unit are arranged on the surface, away from the substrate, of the supporting layer, the infrared absorption unit makes contact with the thermopile assembly to achieve thermal connection between the thermopile assembly and the infrared absorption unit, and an electric insulation structure is arranged between the thermopile assembly and the infrared absorption unit; a self-checking component is also included, when a pressure applying end of the self-checking component is externally connected with a power supply and a grounding end of the self-checking component is grounded, generated heat is conducted to the thermopile assembly through the infrared absorption unit to generate a potential difference so that an electrical response rate of a thermopile can be obtained; an electrical response rate difference value obtained by applying pressure twice is compared with a response rate difference value preset threshold value so that whether the device works normally can be determined; and a self-test function of the MEMS thermopile detector is realized, use of special equipment for testing is avoided, test cost is effectively reduced, time consumption of a device test processis reduced, and the use of the device is more convenient.
Owner:JIANGSU HINOVAIC TECH CO LTD

Dye-sensitized rare earth upconversion material and preparation method thereof

The invention relates to rare earth upconversion materials and preparation methods thereof, in particular to a dye-sensitized rare earth upconversion material and a preparation method thereof and aims to solve the technical problem of low light emitting efficiency of existing dye-sensitized upconversion materials. The dye-sensitized rare earth upconversion material is in a five-layer hollow spherical shell structure which is composed of an inner layer, an inner transmitting layer, a light emitting layer, an outer transmitting layer and an outer layer sequentially from inside to outside, and infrared dye molecules are connected to surfaces of the inner layer and the outer layer of the hollow spherical shell structure. The preparation method includes: taking a silicon dioxide nanosphere as a template, coating the spherical surface of the template with an upconversion shell layer as the light emitting layer, etching the silicon dioxide to obtain a hollow upconversion spherical shell namely the light emitting layer, and simultaneously coating inner and outer surfaces of the hollow spherical shell with Yb<3+>-containing transmitting shell layers and Nd<3+>-containing surface shell layers to construct efficient bidirectional energy transmitting passages, and finally simultaneously connecting the dye molecules to the inner and outer surfaces of the spherical shell to serve as energy absorption antennas. The dye-sensitized rare earth upconversion material is applicable to the biological field of drug loading and controlled release.
Owner:哈尔滨凯美斯科技有限公司

Infrared focal plane array and infrared thermal imaging system based on infrared focal plane array

The invention discloses an infrared focal plane array and an infrared thermal imaging system based on the infrared focal plane array, and belongs to the field of the infrared thermal imaging. The infrared focal plane array comprises a plurality of array units in periodical arrangement, each array unit comprises a substrate, an insulation support layer, a sub-wavelength grating structure and an infrared absorbing layer; the infrared thermal imaging system based on the infrared focal plane array comprises a wavelength conversion module, a read-out signal production module and an imaging displaymodule; a core element of the wavelength conversion module is the infrared focal plane array; the infrared radiation from a target is focused on the focal plane, the infrared image information of thetarget is converted into the temperature distribution information on the focal plane array; the read-out signal production module is used for producing linear polarization narrow-band near infrared ray and enabling the linear polarization narrow-band near infrared ray to enter the imaging display module after being reflected by the infrared focal plane array, thereby realizing target object visualization. The system disclosed by the invention realizes large-area array, high-pixel, low-cost and quick-response thermal imaging system design.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Infrared detector with micro-bridge structure and manufacturing method thereof

The invention relates to an infrared detector with a micro-bridge structure, which belongs to the technical field of micro-electromechanics, and comprises a silicon substrate as a read-out circuit of the infrared detector; a metal reflecting layer deposited on the silicon substrate; a dielectric layer which is deposited in a groove of the metal reflecting layer and has the height being consistent with that of the metal reflecting layer; a sacrifice layer and a first release protection layer used as protection of release of the sacrifice layer which are deposited on the dielectric layer and the metal reflecting layer and form through holes by lithography and etching; a copper or tungsten pier which is deposited in the through hole of the sacrifice layer; a metal electrode deposited on the copper or tungsten pier and the first release protection layer; and a sensitive material detecting layer which is deposited on the metal electrode and the first release protection layer. A Cu-column micro-bridge structure is manufactured by using the damascene process, and a flat micro-bridge plane is manufactured by introducing the chemical mechanical polishing process (CMP), thereby being conductive to the follow-up process and improving the performances.
Owner:ZHEJIANG DALI TECH +1
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