Ceramic substrate assembling device

Abstract

The invention discloses a ceramic substrate assembling device which comprises a metal outer shell base (3) and a ceramic substrate (4) arranged in the metal outer shell base (3). A component (7) is arranged on the top face of the ceramic substrate, array type outer pins (1) which penetrate through the metal outer shell base are arranged on the bottom face of the metal outer shell base, and the outer pins and the metal outer shell base are sintered by insulation media. Welding plate arrays (5) corresponding to the array type outer pins are arranged on the bottom face of the ceramic substrate, and the ceramic substrate and the outer pins are welded through the welding plate arrays. The bottom face of the ceramic substrate and the metal outer shell base are bonded through bonding glue in a filling mode. A metal cover plate is welded on the top of the metal outer shell base in a sealing mode. The ceramic substrate is not directly exposed, and good protection can be achieved. The outer pins and the metal outer shell base are sintered integrally, and the outer pins can not be disengaged from the surface of the substrate easily. The ceramic substrate is connected with the outer pins and the metal outer shell base respectively, a combination assembling structure is achieved, the assembling strength between the ceramic substrate and the metal outer shell base is improved, and the impact performance is improved.

Description

technical field [0001] The invention relates to the field of electronic manufacturing, in particular to a ceramic substrate assembly device. Background technique [0002] As we all know, ceramic substrates are increasingly used in electronic circuits due to their excellent electrical insulation properties and high thermal conductivity; at present, there are usually three structures for the assembly device of ceramic substrate products: 1. The bottom surface of the substrate is welded to the outside of the product. Feet, the metal frame is welded around the top surface of the substrate, and the top surface of the substrate is sealed and welded by the metal cover plate and the metal frame to realize the package. Due to the brittle characteristics of ceramic materials, the substrate under this structure is vulnerable to damage under the action of external mechanical impact stress , the outer pins are directly welded to the surface of the ceramic substrate, and the bonding stren...

AI Technical Summary

Problems solved by technology

[0002] As we all know, ceramic substrates are increasingly used in electronic circuits due to their excellent electrical insulation properties and high thermal conductivity; at present, there are usually three structures for the assembly device of ceramic substrate products: 1. The bottom surface of the substrate is welded to the outside of the product. Feet, the metal frame is welded around the top surface of the substrate, and the top surface of the substrate is sealed and welded by the metal cover plate and the metal frame to realize the package. Due to the brittle characteristics of ceramic materials, the substrate under this structure is vulnerable to damage under the action of external mechanical impact stress , the outer pins are directly welded to the surface of the ceramic substrate, and the bonding strength is low. Under the impact of high acceleration, the outer pins are easy to fall off from the surface of the substrate together with the pad, and the weight of the metal frame is relatively large. It is easy to fall off from the surface of the substrate; 2. The substrate is surrounded by ceramic laminated side walls, and the metal frame is welded on the top of the ceramic side wall, and the metal frame and the metal cover are sealed and welded. Like the first structure, the ceramic substrate and the side wall are exposed outside and are easy to If damaged, the outer pins are easy to fall off; 3. Set a metal shell base, the substrate is bonded in the metal shell base, the outer pins pass through the metal shell base and lead out from the two sides or four sides of the shell base, and the substrate and the outer pins are connected by keys The metal cover plate is sealed and welded to the base of the metal shell. Since the outer pins are not drawn out in an array, the integration density of the circuit assembly is reduced. When the size of the substrate is large, under the action of high-strength mechanical impact, the substrate will stick The connection is easy to fall off from the surface of the base of the metal shell, resulting in circuit failure, which is not conducive to improving the circuit's ability to withstand high impact

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