Embedded chip testing socket and manufacturing method thereof

Abstract

The invention relates to an embedded chip testing socket. The embedded chip testing socket comprises a probe retaining plate and a metal outer frame; a plurality of mounting holes are formed in an array in the metal outer frame; an embedded chip positioning plate is mounted in the mounting holes; steps are formed on the four sides of the embedded chip positioning plate; a lug boss propped against the step is arranged on one side, close to the upper surface, of each mounting hole; a positioning hole distributed in an array are formed in the embedded chip positioning plate, retaining holes corresponding to the positioning holes are formed in the probe retaining plate, and each positioning hole is matched with the corresponding retaining hole to fix a test probe; the embedded chip positioning plate is made of a composite material; the metal outer frame is used for enhancing the strength of the testing socket and simultaneously guaranteeing the electrical properties of the socket; besides, electromagnetic interference between dies in the testing process can be eliminated to a certain extent; the deformation of the metal outer frame is smaller than that of a traditional testing socket; when the number of the test probes is greater than 1500, the surface deformation of the testing socket is still not greater than 0.05MM.

Description

technical field [0001] The invention relates to an embedded chip test socket and a processing method thereof, belonging to the industry of semiconductors and electronic connectors. Background technique [0002] There is a very important process in the chip manufacturing process: the wafer test process, the wafer test is to test each die on the chip, and the test socket with probes on the detection head is connected to the contact on the die. Point contact is used to test the electrical characteristics of the die, and the unqualified die will be marked, and then when the chip is cut into independent dies according to the die, the marked unqualified die will be eliminated and no longer be processed. The next process, so as not to increase the manufacturing cost. [0003] Since the thickness of the wafer is generally around 0.5MM, and even thinner in some cases, the wafer is easily damaged due to uneven force during testing. Therefore, after the test socket for testing the wa...

AI Technical Summary

Problems solved by technology

Traditional test sockets are made of composite materials, such as figure 1 As shown, it is generally composed of upper and lower parts. The integral chip positioning plate 1 is made of composite materials as a whole. If the number of probes used exceeds 300, due to the limited compression of the probes, the test socket with this structure will not be able to meet the requirements. The surface deformation of the socket is less than 0.05MM. At this time, the traditional test socket will add a metal frame 2 to strengthen the strength of the test socket, such as figure 2 As shown, but the metal frame of this structure is limited by the installation features, positioning pins, and screws, which will increase the area of ​​the chip positioning plate 3

Therefore, when the number of probes is greater than 1500, the surface deformation of the test socket is greater than 0.05MM, which does not meet the requirements

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