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Anti-bending bus IC card shell structure

A technology of intelligent bus card and shell structure, which is applied in the direction of recording carriers used in machines, instruments, computer components, etc. It can solve the problems of being bent, chip damage, and easy loss, etc., to slow down distortion and prevent chips from being damaged. loss, improve the effect of buffer protection

Inactive Publication Date: 2014-12-10
MIANYANG MIANZHOUTONG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When most passengers use bus IC cards, they usually carry them with them and put them in their trouser pockets or wallets for easy use; however, due to their small size and thin thickness, bus IC cards are easy to lose or be bent when carrying them. , which in turn causes the bus IC card shell to break and the chip in the card to be damaged

Method used

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  • Anti-bending bus IC card shell structure

Examples

Experimental program
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Effect test

Embodiment 1

[0020] like figure 1 As shown, this embodiment includes an upper casing 1 and a lower casing 2, and the upper casing and the lower casing 2 are connected to each other by rubber blocks 4 to form a closed cavity, and a chip 3 is fixed in the cavity, and the chip 3 and the cavity are provided with fillers 5, and two elastic connecting parts 6 are respectively provided on the outer walls of the upper casing 1 and the lower casing 2, and the width of the connecting parts 6 is the total width of the upper casing 1. a quarter of the width. The work of the present invention is an improvement to the existing bus IC card shell, and the upper casing 1, the lower casing 2 and the rubber block 4 are surrounded to form a cavity, the cavity is provided with a filler 5, and the bus chip 3 is placed In the center of the cavity, when the IC card is impacted or dropped from a high place, the filler 5 can play a certain role in buffering and protecting the chip 3 to avoid damage to the chip 3; ...

Embodiment 2

[0023] like figure 1 As shown, in this embodiment, on the basis of Embodiment 1, the four connecting parts 6 are arranged symmetrically on the outer walls of the upper casing 1 and the lower casing 2 centering on the cavity. Four elastic connecting parts 6 are symmetrically distributed in pairs on the upper casing 1 and the lower casing 2. When the surface of the IC card is impacted by an external force, the elastic recovery of the connecting parts 6 can be superimposed to the maximum, and the direction is consistent with the direction of the external force. On the contrary, to the greatest extent offset the distortion caused by the external force acting on the card surface.

[0024] Preferably, the cross section of the connecting portion 6 is wavy. The connection portion 6 with a wavy cross section can generate a relatively large amount of deformation per unit area, which can further improve the buffer protection of the upper shell 1 and the lower shell 2 .

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Abstract

The invention discloses an anti-bending bus IC card shell structure, comprising an upper shell and a lower shell which are mutually connected by a rubber block to form a closed cavity, wherein a chip is fixed in the cavity, a filler is arranged between the chip and the cavity, the outer wall of each of the upper and lower shells are respectively provided with two elastic connecting parts, and the width of each connecting part is one fourth of the total width of the upper shell. When an IC card is going to be deformed under the effect of an external force forming a right angle or a certain angle with the surface of the card, the two elastic connecting parts arranged on the outer wall of each of the upper and lower shells deform jointly along with the external force direction to retard distortion of the whole card surface caused by the external force, meanwhile the rubber blocks positioned between the upper and lower shells are compressed under stress, the connecting parts for assisting elasticity in a deformation recovering process can reduce distorting intensity of the card surface caused by the external force to be minimal, and thereby the chip is prevented from being damaged by excessive distortion of the IC card.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a bending-resistant smart bus card shell structure. Background technique [0002] IC card refers to integrated circuit card. The bus card we generally use is a kind of IC card. Generally, common IC cards use radio frequency technology to communicate with IC card readers. There is a difference between IC cards and magnetic cards. The card stores information through the integrated circuit in the card, while the magnetic card records information through the magnetic force in the card. The cost of the IC card is generally higher than that of the magnetic card, but the confidentiality is better. The bus IC card is a non-contact data card, it is through the chip integrated in the card through the inductance coil on the card (the inductance coil is also a coil made of copper wire) at both ends of the coil through various The function of the circuit makes the induced current become D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07
Inventor 李强李宝家
Owner MIANYANG MIANZHOUTONG
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