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BT plate electroplating process

A plate electroplating and BT plate technology, which is applied in jewelry and other fields, can solve the problems of uneven electroplating, reduce the qualified rate and service life of BT plate, and achieve the effects of uniform electroplating, prolonging the qualified rate of electroplating and prolonging the service life

Active Publication Date: 2014-12-17
安徽广德威正光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the electroplating process of the BT board in the prior art, it is easy to be unevenly electroplated, resulting in many problems in the use of the BT board, thereby reducing the qualified rate and service life of the BT board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0032] Described BT plate electroplating process, its main steps are:

[0033] Step 1: grinding plate;

[0034] Use a ceramic grinder to grind the BT plate, and change the ceramic brush on the ceramic grinder to a non-woven brush, and use a non-woven brush to grind the BT plate;

[0035] Step 2: Copper sinking treatment;

[0036] A: Enter the expansion cylinder;

[0037] Send the BT board into the expansion cylinder for expansion, the expansion cylinder is filled with expansion agent, the expansion agent is a mixture of potassium oxide and sodium oxide, its alkali equivalent is 0.2N ~ 0.4N, the strength is 35% ~ 50%, and...

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PUM

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Abstract

The invention relates to a BT plate electroplating process. The BT plate electroplating process comprises main steps of plate grinding, copper depositing treatment and acid leaching and copper plating treatment; and through the three steps of plate grinding, copper depositing treatment and acid leaching and copper plating treatment, and in the copper depositing treatment procedure, BT plates are sequentially fed in an expansion cylinder, a smear removing cylinder, a neutralizing cylinder, an oil removing cylinder, a micro-etching cylinder, a preimpregnation cylinder, an activating cylinder, an accelerating cylinder and a chemical copper cylinder, are treated for many times, and are plated with copper, so that the electroplating is uniform, copper ions are tightly bonded on the surfaces of the BT plates, the service life of the BT plates can be prolonged, and the electroplating pass percent of the BT plates can be improved.

Description

technical field [0001] The invention relates to the field of making BT boards, in particular to an electroplating process for BT boards. Background technique [0002] In recent years, with the rapid growth of mobile phones and LED displays, the market demand for SMD light-emitting diodes has also increased. As the carrier board of SMD light-emitting diodes, BT boards have gradually become popular in terms of usage and scope. Most of the BT boards used in the Chinese market are imported, mainly from Japan, South Korea and Taiwan. There are very few mainland Chinese companies that have mastered the core technology of manufacturing BT boards. [0003] BT board refers to the general term for processing BT with BT substrate as the material, and the BT board mentioned in this article refers to the PCB carrier board applied on the SMD light-emitting diode products, which belongs to the special PCB type and is the simplest IC carrier board. The difference from ordinary PCB is the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/56C25D3/38C25D7/00
Inventor 陈燕华
Owner 安徽广德威正光电科技有限公司