Packaging method of display device and display device

Abstract

The invention discloses a packaging method of a display device and a display device. The packaging method of the display device includes the following steps: providing a first substrate, the first substrate has a display area and a non-display area, and the non-display area surrounds the display area; providing an adhesive material disposed on the first substrate, wherein the adhesive material surrounds the display area The periphery of the display area of ​​the first substrate forms a closed curve, the closed curve has an initial area and an end area connected to the initial area; a shading member is provided to at least cover the end area; a heating source is provided to irradiate the shading member, And move the heating source to the starting area of ​​the glued material; and continuously scan the glued material for one week from the starting area along the closed curve to the ending area through the heating source.

Description

technical field [0001] The present invention relates to a packaging method of a display device and the display device, in particular to a packaging method of an organic light emitting display device and the organic light emitting display device. Background technique [0002] Organic Light-Emitting Diode (OLED) has the advantages of self-illumination, high brightness, high contrast, light and thin volume, low power consumption, and fast response. Therefore, it has been gradually applied to various display imaging systems, such as organic light-emitting display device. Among them, although the active matrix organic light emitting display device is more expensive and the process is more complicated, it is suitable for full-color display with large size, high resolution and high information capacity. Therefore, it has become the mainstream of organic light emitting display devices. [0003] An existing packaging method for an organic light-emitting display panel is to use a gla...

AI Technical Summary

Problems solved by technology

However, an arc-shaped gap U will be generated in the starting zone SZ, such as Figure 1B As shown, the arc-shaped gap U will lead to the failure of the subsequent laser sintering sealing process, such as poor sealing of the display panel due to the gap U

[0005] In the discussion of the cause of the gap U, it can be found that the glass glue F is heated and cooled unevenly in the initial zone SZ due to the different heating times of laser scanning, resulting in uneven temperature distribution and differences in the temperature of the glass glue F.

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