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A technology of organosiloxane and polyorganosiloxane, which is applied to the surface coating liquid device, transportation and packaging, and non-metallic protective layer coating, which can solve the problem of uneven layer thickness
Inactive Publication Date: 2019-01-04
ELANTAS
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[0007] If the viscosity of the coating material is too low, there is a risk that the coating material will flow after it has been applied to the electrical or electronic component, which can cause the layer thickness to become unevenly thick or to cover areas of the component that were not intended to be coated coated material
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Embodiment 1
[0162] Thoroughly mix 300 parts by weight of polydivinyldimethylsiloxane (component A) with a viscosity of 50 mPa·s, 30 parts by weight of polydimethylsiloxane (component A) with a Si-H content of 7 mmol / g Component B), 5 parts by weight of 3,5-dimethyl-1-hexyn-3-ol (component D), 0.5 parts by weight of 1% Karstedt's 1,2-divinyltetramethyldi A silicone solution (component C), and a base mixture of 170 parts by weight of a linear polydimethylsiloxane having terminal vinyl groups and terminal Si-H units (component F). At 25°C, the viscosity of the mixture was 40 mPa·s.
[0163] Then, 0.1 parts by weight of diepoxy polysiloxane (component G) with a viscosity of 10 mPa·s and 3 parts by weight of fumed silica coated with dimethylsilane were added to 96 parts by weight of the mixture (Component E).
[0164] At 25°C, in 0.01s -1 The viscosity measured at the shear rate is 430000mPa·s, at 500s -1 The viscosity measured at the shear rate is 120mPa·s.
[0165] Coated according to t...
Embodiment 2
[0167] To 98 parts by weight of the base mixture from Example 1 were added 0.1 parts by weight of diepoxypolysiloxane (component G) with a viscosity of 10 mPa·s and fumed dioxide partially coated with dimethylsilane. Silicon (component E).
[0168] At 25°C, in 0.01s -1 The viscosity measured at the shear rate is 8000mPa·s, at 11s -1 The viscosity measured at the shear rate is 120mPa·s.
[0169] Coated according to the method described above, a uniform coating curtain was obtained, and after coating, the coating on the printed circuit board did not flow anymore.
Embodiment 3
[0171] To 97 parts by weight of the base mixture from Example 1 were added 1 part by weight of diepoxypolysiloxane (component G) with a viscosity of 10 mPa·s and 2 parts by weight of uncoated fumed silica ( Component E).
[0172] At 25°C, in 0.01s -1 The viscosity measured at the shear rate is 390000mPa·s, at 400s -1 The viscosity measured at the shear rate is 120mPa·s.
[0173] Coated according to the method described above, a uniform coating curtain was obtained, and after coating, the coating on the printed circuit board did not flow anymore.
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Abstract
A one-component, solvent-free organosiloxane composition comprising: a) 10 to 98% by weight of at least one linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups as component A ; b) 0.1 to 30% by weight of at least one linear or branched polyorganosiloxane containing at least 3 Si-H groups as component B; c) 0.000001 to 1% by weight of at least one hydrosilylation catalyst as Component C; d) 0.00001 to 5% by weight of at least one acetylenic alcohol of general formula (I) as component D, wherein R 1 , R 2 , R 3 independently selected from H, C 1 -C 6 Alkyl and substituted or unsubstituted C 3 -C 6 Alkyl; or R 1 Choose from H, C 1 -C 6 Alkyl and substituted or unsubstituted C 3 -C 6 Cycloalkyl, and R 2 , R 3 Combined to form a 3-8 membered ring, which can be composed of one or more C 1 -C 3 Alkyl substitution; e) 0.1 to 10 wt% of at least one fumed silica as component E; and f) 0 to 89.799989 wt% of one or more other groups selected from F, G, H and I points; wherein the sum of components A to I is 100wt%.
Description
technical field [0001] The present invention relates to a one-component, solvent-free organosiloxane composition comprising fumed silica and an acetylenic alcohol, and the use of said composition to apply a protective organosiloxane coating to printed circuits by means of a cross-cut nozzle plates, and such organosiloxane protective coatings. Background technique [0002] Electrical and electronic assemblies, especially printed circuit boards, have become smaller in recent years to allow for higher packing densities. Premature failure of such components due to moisture, dust and thermal and mechanical stress can be prevented by protective varnishes or coatings. Higher demands are placed on the painting or coating process. In many cases, in addition to allowing uniform layer thicknesses and reproducible coating effects, they must also allow selective lacquer application. [0003] Contact areas, plug connectors, mechanical components, etc. must not be wetted by the protecti...
Claims
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Application Information
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