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Anti-vibration reliability design method and system for micro-assembled components

A technology of micro-assembly components and design methods, applied in computing, special data processing applications, instruments, etc., can solve the problem of low anti-vibration reliability and achieve the effect of improving anti-vibration reliability

Active Publication Date: 2017-05-10
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

The traditional parallel seam welding optimization design method for micro-assembly components is carried out for the airtightness of the component products and the applicability of the seam welding process. Through process tests, the angle of the seam welding electrode and the width of the weld seam are optimized to meet the air-tightness requirements of the micro-assembly components. However, it cannot eliminate the risk of cracking caused by resonance of the metal package shell in a vibration environment, and has the disadvantage of low vibration resistance reliability

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  • Anti-vibration reliability design method and system for micro-assembled components
  • Anti-vibration reliability design method and system for micro-assembled components
  • Anti-vibration reliability design method and system for micro-assembled components

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describin...

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Abstract

The invention relates to a design method and a system for the anti-vibration reliability of a micro assembly component. The design method comprises the following steps of building a vibration characteristic simulation finite element model according to a structure of the micro assembly component; obtaining a corresponding relation between different weld joint widths and a first natural frequency according to the vibration characteristic simulation finite element model, and further acquiring a weld joint critical width corresponding to a preset critical frequency; calculating to obtain welding critical power and a welding electrode critical angle according to the weld joint critical width, designing seam welding key process parameters of the micro assembly component, and carrying out seam welding processing on the micro assembly component according to the determined welding critical power and the welding electrode critical angle. According to the design method, the vibration characteristic simulation finite element model is built to carry out vibration simulative emulation to confirm the weld joint critical width, and the seam welding key process parameters can be confirmed by adopting the weld joint critical width as a criterion, so that compared with the traditional micro assembly component design method, the anti-vibration reliability of the micro assembly component is improved.

Description

technical field [0001] The invention relates to the technical field of electronic device reliability design, in particular to a vibration-resistant reliability design method and system for micro-assembled components. Background technique [0002] With the development of science and social progress, the requirements for the integration of electronic products are getting higher and higher. Micro-assembly components refer to high-density integrated functional devices that encapsulate electronic components with metal and other materials, which can protect the electronic components in them from atmospheric water vapor corrosion. The current micro-assembly components mainly use parallel seam welding process for package welding. [0003] In order to ensure the anti-vibration reliability of micro-assembly components, the product should optimize the welding structure of the parallel seam welded metal package shell during the research and development stage to avoid the risk of resona...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 何小琦李勋平恩云飞周斌王军德
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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