Composite water cooling plate

Abstract

The invention provides a composite water cooling plate which is made of aluminum and comprises a cover plate, a water cooling plate body and a bottom plate. The cover plate, the water cooling plate body and the bottom plate are sequentially arranged from top to bottom. The composite water cooling plate is characterized in that a first S-shaped flow channel and a second S-shaped flow channel which are sunken towards the inside of the water cooling plate body are respectively arranged on the upper surface and the lower surface of the water cooling plate body, the first flow channel is of a closed circuit structure, and the second flow channel is connected with an inlet and an outlet which are formed in two sides of the water cooling plate body. Compared with the prior art, the composite water cooling plate has the advantages that a pulse heat pipe and the water cooling plate are organically combined with each other, so that heat of electric equipment with high heat flow density can be effectively dissipated, the technical difficult problem of ultrahigh surface temperatures of electronic devices due to the difficulty in dissipating heat with high heat flow density can be solved, and the surface temperature of the cooling plate can be reduced by 5-10 DEG C as compared with a heat exchange technology implemented by a single cooling plate under identical conditions.

Description

technical field [0001] The invention relates to a water-cooled plate, in particular to a composite water-cooled plate used for heat dissipation of electronic devices with high power and high heat flux. Background technique [0002] The water-cooled plate uses a compact and relatively thin plate-shaped metal to arrange fluid channels inside it, so that convective heat exchange occurs between the fluid and the water-cooled plate, thereby dissipating the thermal power consumption of high-power electronic components on the surface of the water-cooled plate . The application advantage of the water-cooled plate is that more heat can be dissipated per unit area, so the structure of the radiator can be miniaturized. [0003] With the development and application of new technologies such as high power density engines, electromechanical hybrid transmissions, and electric transmissions, the heat dissipation of electronic devices continues to increase, and the heat flux density doubles....

AI Technical Summary

Problems solved by technology

[0004] The existing single cold plate heat dissipation technology has been difficult to meet the heat dissipation requirements of high power density in the future, and the heat dissipation research based on the pulsating heat pipe and cold plate composite technology provides a new development direction for future high heat flux heat dissipation, and has broad application prospects

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