Silicon chip collection device for linear cutting machine

Abstract

The invention relates to a silicon chip collection device for a linear cutting machine. The silicon chip collection device comprises a trough body, wherein one end of the trough body is open; at least one movable storage mechanism is arranged in the trough body, and comprises support bodies arranged in the trough body and a moving platform supported in the trough body through the support bodies. During the cutting of a silicon rod, when cut silicon chips are collected, the moving platform is not arranged in the trough body, the silicon chips are collected in the bottom space of the trough body at first, the moving platform is arranged on the support bodies after the bottom space is filled with the silicon chips, and then the silicon chips are collected in a space at the upper end of the moving platform; when the silicon chips are picked up or moved, only the moving platform is required to be extracted from the trough body, and a spare moving platform is arranged in the trough body for collection, so that influence on the cutting of the silicon chips is eliminated, and the working efficiency is improved; a plurality of layers of collection platforms are used for collecting the silicon chips, so that the squeezing and the accumulation of the silicon chips are avoided, and quality in a silicon chip collection process is ensured.

Description

technical field [0001] The invention relates to auxiliary equipment for silicon wafer processing, in particular to a silicon wafer collecting device for a wire cutting machine used in the process of cutting silicon wafers. Background technique [0002] In the production process of silicon wafers, it is necessary to use a wire cutting machine to cut silicon rods into pieces, and collect the cut silicon wafers. The existing collection device is only a tank, so that the cut silicon wafers When collecting, there will be mutual extrusion and overlapping, and the silicon wafers will easily be damaged when picking up, which will increase the production cost. At the same time, picking up is inconvenient and the work efficiency is low. Contents of the invention [0003] In view of the above technical problems, the present invention provides a silicon wafer collection device for wire cutting machines, which can effectively prevent the silicon wafers from being squeezed and overlappe...

AI Technical Summary

Problems solved by technology

[0002] In the production process of silicon wafers, it is necessary to use a wire cutting machine to cut silicon rods into pieces, and collect the cut silicon wafers. The existing collection device is only a tank, so that the cut silicon wafers When collecting, there will be mutual extrusion and overlapping, and it is easy to cause damage to the silicon wafer when picking up, which will increase the production cost. At the same time, it is inconvenient to pick up and the work efficiency is low.

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