Cluster Vacuum Bonding System

Abstract

The invention discloses a cluster-type vacuum bonding system, which employs a separate joint neck, and is used for transmitting a substrate and performing corresponding manufacture procedures under a vacuum environment. The cluster-type vacuum bonding system comprises a cavity, at least one joint neck, a regulating mechanism, a sealing sheet and a sealing washer. The cavity comprises at least one flange. The joint neck is arranged on the flange. The joint neck comprises a closure plate, and at least one opening is formed in the surface of the closure plate. The regulating mechanism is arranged between the cavity and the joint neck, and is used for regulating the angle, relative to the cavity, of the joint neck. The sealing sheet is arranged on the surface of the closure plate. The sealing sheet is provided with at least one opening, and the opening of the sealing sheet is aligned to the opening of the closure plate. The sealing washer is arranged on the opening of the sealing sheet in a rounding manner. The cluster-type vacuum bonding system not only is applied to the transmission of multi-sheet substrates, but also has good stability in sealing.

Description

technical field [0001] The present application provides a cluster-type vacuum bonding system, especially a cluster-type vacuum bonding system with high stability and multi-chip transfer function. Background technique [0002] In order to achieve better vacuum quality in the traditional vacuum bonding system, the combination between the cavity and the cavity and between the cavity and the gate valve is mostly a fixed device. Therefore, in the overall planning of the system and the number of cavities It cannot be adjusted according to the actual needs of users, resulting in the disadvantages of occupying space, increasing costs, and excessively long idle time. Another conventional vacuum bonding system uses a curved bonding neck, which utilizes a thin sheet as the sealing interface between the process chamber and the transfer chamber. An opening is formed on the surface of the sheet for transferring the substrate. The periphery of the opening of the sheet is sealed with the ...

AI Technical Summary

Problems solved by technology

However, the deformable amount of the sheet is small, so the gap between the two cavities before bonding is correspondingly small, so the structural design of the traditional vacuum bonding system requires extremely high precision

As a result, the vacuum adsorption area of ​​the traditional vacuum bonding system is large, and its large vacuum adsorption force will affect the stability of the system

For example, too much vacuum adsorption force will affect the structural stability of the power device driving the cavity and the rigidity of the joint. If the joint is deformed due to insufficient rigidity, vacuum sealing failure will easily occur.

Excessive vacuum adsorption force will destroy the relative position of the two adjacent cavities, causing the structure to be pulled and deformed; similarly, excessive vacuum adsorption force will also destroy the flat tolerance of the joint, so the traditional vacuum bonding system is not suitable for today's large-scale Transfer requirements for substrates or multi-piece substrates

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