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Detection method for internal cracks in chip capacitors

A chip capacitor and detection method technology, applied in the preparation of test samples, etc., can solve the problems of long experimental period, difficult to keep experimental samples, and difficult to find dark cracks in chip capacitors, etc., to achieve short experimental period and fast delivery Determining the analysis conclusion and retaining the effect of the fault capacitance

Active Publication Date: 2017-01-04
GREE ELECTRIC APPLIANCES INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is difficult to find out whether there are dark cracks in the chip capacitor, because the four sides of the chip capacitor except the two end faces in the length direction may have dark cracks, and the experiment period is long, and the experimental samples are not easy to keep

Method used

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  • Detection method for internal cracks in chip capacitors
  • Detection method for internal cracks in chip capacitors
  • Detection method for internal cracks in chip capacitors

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Embodiment Construction

[0022] The present invention will be described in detail below with reference to the accompanying drawings and examples. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0023] "SMD capacitor" is "multilayer chip ceramic capacitor", which is made of ceramic slurry by casting a plurality of ceramic dielectric films with a thickness of less than 10 microns, and then printing internal electrodes on the dielectric film, alternately stacking heat Pressure to form several capacitors connected in parallel and sintered at high temperature to form an inseparable whole chip. figure 1 Shown is a three-dimensional structure schematic diagram of a chip capacitor. The chip capacitor 10 includes a cuboid capacitor body 12 and terminal electrodes 14 arranged at both ends of the capacitor body 12 in the length direction.

[0024] The inventors of the present invention have developed a method for q...

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Abstract

A method for detecting dark cracks inside a chip capacitor, comprising the following steps: S1, selecting any three sides of the chip capacitor as the first grinding surface, the second grinding surface and the third grinding surface; S2, using the chip capacitor Paste and fix the side opposite to the first grinding surface on the grinding plate, grind the first grinding surface with sandpaper, and then use a magnifying glass to observe whether there are dark cracks on the first grinding surface; S3. Paste and fix the side on the grinding plate, grind the second grinding surface with sandpaper, and then use a magnifying glass to observe whether there are dark cracks on the second grinding surface; S4, paste and fix the side of the chip capacitor opposite to the third grinding surface on the grinding plate , Grind the third grinding surface with sandpaper, and then use a magnifying glass to observe whether there are dark cracks on the third grinding surface. The method for detecting dark cracks inside the chip capacitor of the present invention can quickly identify whether there are dark cracks inside the chip capacitor, and the test period is short; moreover, the body of the chip capacitor will not be damaged.

Description

technical field [0001] The invention relates to a detection method, in particular to a detection method for internal cracks in chip capacitors. Background technique [0002] "SMD capacitor" is "multilayer chip ceramic capacitor", which is made of ceramic slurry by casting a plurality of ceramic dielectric films with a thickness of less than 10 microns, and then printing internal electrodes on the dielectric film, alternately stacking heat Pressure to form several capacitors connected in parallel and sintered at high temperature to form an inseparable whole chip. [0003] In recent years, after-sales and production processes have repeatedly reported that chip capacitors have a problem of small capacitance. After analysis, the inventor found that the root cause of the small capacitance of chip capacitors is internal cracks in chip capacitors. [0004] In the prior art, an embedding method is generally used to analyze whether there is a dark crack inside the capacitor, that is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/32
Inventor 杨善明张成成陈彩欢郭懿远解伟崔斌
Owner GREE ELECTRIC APPLIANCES INC