A three-dimensional printing method of hollow three-dimensional model
A three-dimensional model and three-dimensional printing technology, applied in processing and manufacturing, additive processing, etc., can solve problems such as waste of materials, high cost and complexity of three-dimensional printing, and achieve the effects of reducing costs, reducing printing time, and saving raw materials
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] refer to figure 1 , a kind of three-dimensional printing method of hollow three-dimensional model that the present invention proposes, and three-dimensional model is decomposed into skin layer and rigid frame layer, and prints after hollowing out the rigid frame layer, concrete steps are as follows:
[0024] S1. Obtain a three-dimensional model of an object.
[0025] S2. Obtain the skin layer model and parameters according to the three-dimensional model.
[0026] The appearance size of the skin layer model is consistent with the appearance size of the three-dimensional model, and the skin layer parameters include its thickness.
[0027] S3. Extracting feature points of the three-dimensional model, constructing a rigid frame layer model, the rigid frame layer model is a hollow structure, specifically a closed mesh structure.
[0028] The rigid frame layer model is designed according to the feature points of the three-dimensional model, which is not only conducive to su...
Embodiment 2
[0036] refer to figure 2 , a kind of three-dimensional printing method of hollow three-dimensional model that the present invention proposes, and three-dimensional model is decomposed into skin layer and rigid frame layer, and prints after hollowing out the rigid frame layer, concrete steps are as follows:
[0037] S1'. Obtain the stereo model of the object.
[0038] S2'. Obtain the skin layer model and parameters according to the three-dimensional model.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

