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Internal matching structure for controlling harmonic impedance for power transistor

A power transistor and harmonic impedance technology, applied in the field of internal matching structure, can solve problems such as reducing the efficiency of power amplifier tubes, and achieve the effect of improving efficiency

Active Publication Date: 2015-01-07
长沙瑶华半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004]According to the design theory of power amplifiers, if only the fundamental wave component is used to make a Class-AB power amplifier, the efficiency at the saturation point is only 78%. The voltage and current of the fundamental wave have a relatively large superposition, and this superposition becomes the heat consumption of the transistor itself, which seriously reduces the efficiency of the power amplifier tube

Method used

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  • Internal matching structure for controlling harmonic impedance for power transistor
  • Internal matching structure for controlling harmonic impedance for power transistor
  • Internal matching structure for controlling harmonic impedance for power transistor

Examples

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Embodiment

[0021] In this embodiment, the output internal matching structure is taken as an example, and the input internal matching structure may be set with reference to the output internal matching structure.

[0022] In this embodiment, the internal matching capacitor in the output internal matching structure includes two capacitors C2 and C3. Such as image 3 and 4 As shown, L2, L3 and L4 are bonding wire inductances, C1 and C2 are MOSCAP capacitors, and M1 is a power device die. Die M1 is connected to C2, C3 is connected to the output pin, and M1 is connected to the output pin. Inductor L4 and capacitor C3 resonate at twice the operating frequency of the device, forming a short circuit. In this way, the harmonic impedance presented by the die M1 does not change with the change of the external matching circuit. And the harmonic impedance can be adjusted through the selection of L4, thereby improving the efficiency.

[0023] The output internal matching structure can also ...

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Abstract

The invention discloses an internal matching structure for controlling harmonic impedance for a power transistor. The internal matching structure comprises a tube core and a matching circuit for connecting the tube core with an input pin or an output pin, wherein the matching circuit comprises at least one capacitor; and the capacitor which is directly connected with the input pin or the output pin through a bonding wire and an inductor which is connected with the input pin or the output pin and is constructed by a bonding wire at the other end perform resonance oscillation at a position where the working frequency of the transistor is increased twice. The inductor constructed by the bonding wire and the capacitor perform resonance oscillation at a position where the working frequency of the transistor is increased twice, thereby forming short circuit. The harmonic impedance shown by the tube core M1 does not change along with the change of an external matching circuit. The harmonic impedance can be regulated through selection of L4, so that the efficiency is increased. The harmonic impedance is purely inductive, and no power is consumed, so that the efficiency of the power transistor can be increased through adoption of the structure.

Description

technical field [0001] The invention relates to the field of power devices, in particular to an internal matching structure for controlling harmonic impedance of a power transistor. Background technique [0002] Power devices, mainly power devices based on RF LDMOS structure, usually include the following parts: power device die, usually RF LDMOS die, input internal matching capacitor, output internal matching capacitor, such as figure 1 and 2 As shown, L1, L2, L3 and L4 are bonding wire inductances, C1 and C2 are MOSCAP capacitors, M1 is a power device die, the input uses T-type matching, and the output uses L-type matching. [0003] In the design of the above-mentioned power amplifier transistors, it is assumed that the output capacitance of the power transistor is large, and all harmonic components are filtered out by the output capacitor, and the harmonic components are all zero. However, with the development of current process technology and the improvement of die des...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F1/02
Inventor 曾大杰尹利娟张耀辉
Owner 长沙瑶华半导体科技有限公司