Water-cooling heat dissipation device

A water-cooled heat dissipation and radiator technology, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of many connection interfaces, increase the overall size of the structure, and small water capacity of the waterway, so as to reduce the connection interface, improve the reliability, The effect of increasing water capacity

Active Publication Date: 2015-01-14
STATE GRID CORP OF CHINA +2
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

The indirect cooling method is to insert the damping resistance rod into the radiator, and dissipate heat indirectly through the cooling water in the radiator. The disadvantages of this method are: first, the heat dissipation capacity is weak; second, the radiator is relatively large ; Third, the radiator consumes a lot of water
The heat dissipation capacity of the direct cooling method is higher than that of the indirect cooling method, but it still has its limitations: the water capacity of the waterway is small, the dry burning ability is poor, and the cut-off time is generally less than 3 seconds
[0004] At present, the thyristor radiator and the water-cooling damping resistor are designed independently, which not only increases the overall size of the structure, but also reduces the reliability of the waterway connection due to the large number of connection interfaces.

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Embodiment Construction

[0023] The specific implementation manners of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0024] In order to clearly understand the technical solution of the present invention, its detailed structure will be presented in the following description. Obviously, the implementation of the embodiments of the invention is not limited to specific details familiar to those skilled in the art. The preferred embodiments of the present invention are described in detail below, and the present invention may have other embodiments besides the embodiments described in detail.

[0025] combine figure 1 and figure 2 , figure 1 It is a schematic diagram of the front and side structures of the water-cooling heat dissipation device of the present invention; figure 2 It is a schematic diagram of the back structure of the water-cooling heat dissipation device of the present invention; figure 1 and figure 2 The semi-enclose...

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Abstract

The invention discloses a water-cooling heat dissipation device which is a hexahedron of an irregular front-rear face structure. The hexahedron is tightly attached to the upper face of a thyristor to be cooled, the thyristor is a semi-conductor device provided with four or more layers of P layers and N layers which are arranged in a staggered mode, and first openings are formed in the regions, relative to the N-type semi-conductor layers serving as cathodes, in the P-type semi-conductor layers making contact with the N-type semi-conductor layers serving as the cathodes. The half-surrounding type water-cooling heat dissipation device comprises a thyristor heat dissipation device and a damping resistance heat dissipation device and a connector (5). The damping resistance heat dissipation device and the thyristor heat dissipation device are integrated in the irregular hexahedron, and the damping resistance heat dissipation device half surrounds the thyristor heat dissipation device. By means of the water-cooling heat dissipation device, the size of a water cooling system is contracted greatly, the structure of a converter valve is simplified, connection openings of the water cooling system are reduced, the water capacity of the water cooling system is increased, and the reliability of the water cooling system is improved.

Description

technical field [0001] The invention relates to a heat dissipation device of a water cooling system, in particular to a water cooling heat dissipation device of a direct current transmission converter valve. Background technique [0002] Water-cooling system is widely used in the cooling of DC converter valves. Converter valves are usually composed of thyristors, damping capacitors, voltage equalizing capacitors, damping resistors, voltage equalizing resistors, saturated reactors, thyristor control units and other components. Among them, the thyristor is the core component of the converter valve, which determines the flow capacity of the converter valve, and the desired system voltage can be obtained by connecting multiple thyristor elements in series. The thyristor and damping resistor are one of the core cooling objects of the water cooling system. Therefore, the rationality of the design of the thyristor radiator and the damping resistor radiator plays a very important r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367
Inventor 王治翔汤广福周建辉蓝元良查鲲鹏谢剑李云鹏刘杰王航
Owner STATE GRID CORP OF CHINA
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