Unlock instant, AI-driven research and patent intelligence for your innovation.

A printed circuit board

A printed circuit board, voltage difference technology, applied in the direction of printed circuit, printed circuit, printed circuit components, etc., can solve problems such as blast hole, short circuit, failure of via electrical connection, etc., and achieve the effect of reducing the risk of short circuit

Active Publication Date: 2019-02-12
CONTINENTAL AUTOMOTIVE (CHANGCHUN) CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] for figure 1 For the corresponding printed circuit board with double-sided cover holes, since the openings on both sides of the via hole are sealed by the protective cover, air bubbles will be sealed inside the via hole, and the bubbles will expand during soldering, which will cause the electrical connection of the via hole to be damaged. Function failure or burst hole phenomenon
[0009] for figure 2 For the corresponding printed circuit board with one-sided cover hole, the one without a protective cover is still prone to short circuit due to the interaction of condensation, voltage difference between vias and dendritic impurities

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A printed circuit board
  • A printed circuit board
  • A printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be described in detail below with reference to the accompanying drawings and examples. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0023] The printed circuit board of the present invention comprises at least one layer of insulating board and a plurality of via holes penetrating the at least one layer of insulating board, each of the plurality of via holes is arranged on the upper surface or the lower surface of the printed circuit board The protective cover at the opening of the hole and the single-side cover hole, wherein, a part of the through holes in the plurality of through holes are provided with a protective cover on the upper surface of the printed circuit board, and the rest of the through holes are provided with a protective cover on the lower surface of the printed circuit board.

[0024] The above printed circu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a printed circuit board which comprises at least one layer of insulation plate and a plurality of via holes. The via holes penetrate through the at least one layer of insulation plate. One sides of the via holes are covered by protecting covers arranged at hole openings in the upper surface or the lower surface of the printed circuit board. Parts of the via holes are provided with protecting covers at the upper surface of the printed circuit board, and the other parts of the via holes are provided with protecting covers at the lower surface of the printed circuit board. According to the printed circuit board, on the basis that the problem that via hole electric connecting loses efficacy or a hole exploding phenomenon happens due to bubble expanding is avoided, the risk of short circuiting of the printed circuit board, especially a complex printed circuit board designed in high density caused by pollution can be relieved.

Description

technical field [0001] The present invention relates to the technical field of circuit electronics, and more specifically, to a printed circuit board. Background technique [0002] Printed Circuit Board (PCB) is the support body of electronic components and the provider of electrical connection of electronic components. The printed circuit board is based on an insulating board, on which at least one conductive pattern is attached and has holes to realize the interconnection between electronic components. [0003] Printed circuit boards can be divided into single-sided boards, double-sided boards and multi-layer boards. A via (via) is a common hole drilled on the printed circuit board at the intersection of the wires that need to be connected in each layer in order to connect the printed wires between the layers. The cylindrical surface of the hole wall of the common hole is chemically The deposition method is to plate a layer of metal to connect the copper foils that need ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K1/02
CPCH05K1/116H05K2201/096H05K2201/09636
Inventor 张明王志宏
Owner CONTINENTAL AUTOMOTIVE (CHANGCHUN) CO LTD