Apparatus for processing fragile substrate using multi lasers and method thereof
A technology for processing brittleness and lasers. It is used in laser welding equipment, metal processing equipment, lasers, etc. It can solve the problems of long processing time, cracks in the workpiece, and high defect rate, and promote energy changes, thermal damage or structural deformation. , the effect of reducing the thermal diffusion phenomenon
Inactive Publication Date: 2015-01-21
AP SYST INC
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[0004] In addition, laser processing is a non-contact cutting method based on heat transfer and has problems in that chips are generated from the workpiece and cracks occur in the workpiece when the workpiece is processed, the defect rate is high, and the processing time is considerably long
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[0016] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Referring now to the drawings, wherein the same reference numerals are used throughout the different views to designate the same or like components. If in the specification, detailed descriptions of well-known functions or configurations will be omitted if they would unnecessarily obscure the gist of the invention. When an explanatory phrase "a component includes a component" is used, it means that the component further includes other components rather than excluding components, as long as no specific explanation is given.
[0017] figure 1 is a block diagram illustrating an apparatus for processing a brittle substrate using multiple lasers according to an embodiment of the present invention. refer to figure 1 , the device 100 according to the present invention includes a picosecond laser 110 , a femtosecond laser 120 , a laser controller 130 , a...
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Abstract
Disclosed herein is an apparatus for processing a fragile substrate using multi lasers. The apparatus comprises a picosecond laser device which generates a first laser pulse with a picosecond-level pulse width; a femtosecond laser device which generates a second laser pulse with a femtosecond-level pulse width; a laser controller which calculates a time difference between the first and second laser pulses, delaying the first or second laser pulse according to the time difference, and outputting the first and second laser pulses as third and fourth laser pulses respectively; a reflecting mirror which changes the direction of the third or fourth laser pulse; and a lens which allows the third and fourth laser pulses to pass through and enables the third and fourth laser pulses to be overlapped.
Description
technical field [0001] The present invention generally relates to an apparatus and method for processing brittle substrates using multiple lasers in laser micromachining, and more particularly, to an apparatus and method for processing brittle substrates using picosecond lasers and femtosecond lasers together, thereby increasing processing speed and minimizing defects. lowest rate. Background technique [0002] Generally, cutting methods such as scribing, scribing, and blade methods are used to cut substrates such as glass substrates, silicon substrates, and ceramic substrates. In processing such substrates, in particular, laser processing is non-contact processing, which has advantages in that laser processing facilitates processing of high hardness and brittle materials, reduces the occurrence of noise during processing, and makes it easy to process complex shapes such as free curves. Therefore, laser processing is put into use in various fields. [0003] In such laser p...
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IPC IPC(8): B23K26/0622B23K26/402C03B33/08
CPCC03B33/082Y02P40/57B23K26/06B23K2103/50G02B26/10H01S3/109
Inventor 郑珩仑金长贤申兴铉
Owner AP SYST INC