Special colored ink protective film for antenna board and its manufacturing method

Abstract

The invention discloses an antenna board special-purposed colored printing ink protection film and a preparation method thereof. The antenna board special-purposed colored printing ink protection film is composed of a first release layer, a pressure-sensitive adhesive layer, a printing ink layer, an adhesive layer, and a second release layer. The adhesive layer is formed on the surface of the second release layer. The printing ink layer is formed on the surface of the adhesive layer. The pressure-sensitive adhesive layer is formed on the surface of the first release layer. The pressure-sensitive adhesive layer is sandwiched between the first release layer and the printing ink layer. Compared with traditional protection films, the antenna board special-purposed colored printing ink protection film is thinner in thickness. The protection film provided by the invention has good softness, a color masking function, good chemical resistance, good electrical property, and good flexibility. With a traditional protection film, a carrier film should be applied at a protection layer. With the protection film provided by the invention, during an antenna board manufacturing process, the step is eliminated, such that manufacturing cost and process flow are saved to a certain extent. Also, bubble yield of the pressure-sensitive adhesive layer is solved.

Description

technical field [0001] The invention relates to a special protective film for a wireless communication antenna board and a manufacturing method thereof, in particular to a color ink protective film capable of omitting a carrier film on the side of the protective film when the antenna board is manufactured and a manufacturing method thereof. Background technique [0002] Polyimide (PI) resin has been widely used in electronic materials. Among them, the polyimide copper foil substrate used for flexible printed circuit boards is generally divided into single-sided or double-sided. Usually, the application of polyimide copper foil substrates is limited by the composition and thickness of polyimide materials, and the wiring materials of small electronic products are mostly flexible printed circuits with high design freedom and good flexibility. Board (Flexible Printed Circuit, hereinafter referred to as FPC), and in the continuous development of high speed and high deflection, va...

AI Technical Summary

Problems solved by technology

[0004] In the production process of the antenna board circuit, the carrier film (carrier film) needs to be laminated on both sides to increase its stiffness. The process is cumbersome and limited by the thickness of the traditional protective film, it is impossible to develop smaller and lighter.

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