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An intelligent packaging and monitoring system with indicators and its manufacturing method

A technology of intelligent packaging and monitoring system, applied in radio wave measurement system, packaging, packaged food, etc., can solve problems such as unreliable electrical characteristics, unstable conductive ink, etc.

Active Publication Date: 2017-03-15
智能设备赛兹科公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Unreliable electrical characteristics due to instability of conductive inks printed on cardboard substrates

Method used

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  • An intelligent packaging and monitoring system with indicators and its manufacturing method
  • An intelligent packaging and monitoring system with indicators and its manufacturing method
  • An intelligent packaging and monitoring system with indicators and its manufacturing method

Examples

Experimental program
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Embodiment Construction

[0107] The present invention uses techniques discussed in Canadian Application No. 2719054, which is incorporated herein by reference.

[0108] will first discuss Figure 1 to Figure 8 , to describe an example of using the contents of a monitoring package and its method of manufacture. This particular example is shown in the context of consumption of pharmaceutical medicaments in blister packs; however, it will be appreciated that other shapes, sizes and types of packages containing other types of contents may also be monitored.

[0109] figure 1 Various layers are shown using an example of monitoring the contents of a package. The cover 10 or top layer is preferably made of Easy Pallet or similar material. This is immediately below the blister card 12 of medication, each blister aligning with a cutout 20 in the lid 10 . The third layer comprises a reusable electronic sensor-monitored tag 14 connected by a flat flexible connector 26 to a conductive grid 16 printed on a t...

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PUM

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Abstract

There is provided a smart package and monitoring system having a status indicator and a method of making the same. The smart package includes an electronic sensor monitoring tag having re-usable electronic circuitry and power source along with a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device. The conductive grid is aligned with an opening of the smart package. The smart package can also include an optical ink indicator configured to display the status of the package. A multiplexer can be used to connect the tag to the conductive grid. The conductive grid can include capacitive sensors formed on a thin plastic layer and positioned so as to form a capacitive element with the conductive side of the blister.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to Canadian Application No. 2775546, filed April 25, 2012, which is incorporated herein by reference. technical field [0003] The present invention relates to the use of monitoring package contents with status indicators and methods of manufacture thereof. Background technique [0004] Alan Wilson, Michael Peterson, Evansld Jacobs, and Grip Steiner, among others, describe a system for monitoring, recording, and downloading dosing histories of blister-packed medications devices; see for example US Patent Nos. 7113101, 7178417, 6628199, 6244462, 7170409, 6616035, 7616116 and 7772974 and PCT Application Publication No. WO / 2009 / 135283. See also Canadian Application No. 2353350 and US Publication Nos. 20070278285, 20080191174 and 20080053222. [0005] Such devices broadly include sensor detection / monitoring electronic tags, sensor grids printed with conductive ink, means to connect the tw...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D75/36A61J7/04B65D83/04H05K1/02G01V3/08
CPCH05K1/118A61J1/035A61J7/0409A61J7/0436A61J2205/20H05K1/0269H05K1/0287H05K1/16H05K3/1275H05K2203/1545Y10T29/49155
Inventor 艾伦·威尔逊迈克尔·彼得森德安·布鲁特色
Owner 智能设备赛兹科公司
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