Chip package dispensing head

Abstract

The invention discloses a chip package dispensing head, relates to the field of mechanical devices, and in particular relates to a chip package dispensing head. The chip package dispensing head comprises an injector and a support plate, a dovetail groove is formed in the center of the support plate, one side of the support plate is provided with a back plate, and the other side of the back plate is connected with a baffle through a connecting plate; the head part of the injector penetrates through the dovetail groove and is fixed; the back plate is provided with a U-shaped spring clip for fixing the tail part of the injector; the tail end of the U-shaped spring clip is provided with an adjusting screw, and the tail end of the injector is provided with a sealing ring. According to the chip package dispensing head disclosed by the invention, the injector can be conveniently replaced, automatic clamping can be realized, pose adjusting is convenient, and the operation is flexible.

Description

technical field [0001] The invention relates to the field of mechanical devices, in particular to a chip packaging dispensing head. Background technique [0002] In the process of chip packaging, it is necessary to spread organic glue on the substrate in advance, and then mount the chip on the substrate to realize the functions of solid connection between the chip and the substrate, conduction (or insulation), heat insulation or mechanical protection of the chip. Since the characteristics of the colloid used in electronic packaging are significantly affected by temperature, the colloid is generally sealed in the dispensing head and stored below -27°C. When replacing or adding the colloid, the dispensing head is generally replaced and re-clamped. However, With the development of packaging technology towards high speed, high precision, and high density, the dispensing process is required to have the characteristics of micro, high frequency, and high consistency, and the relati...

AI Technical Summary

Problems solved by technology

Since the characteristics of the colloid used in electronic packaging are significantly affected by temperature, the colloid is generally sealed in the dispensing head and stored below -27°C. When replacing or adding the colloid, the dispensing head is generally replaced and re-clamped. However, With the development of packaging technology towards high speed, high precision, and high density, the dispensing process is required to have the characteristics of micro, high frequency, and high consistency, and the relative pose between the dispensing head and the substrate affects the dispensing consistency. One of the main factors, therefore, when replacing the dispensing head, the fixture must have high repeat positioning accuracy, flexible operation, and convenient adjustment. However, the current dispensing heads cannot meet the requirements very well.

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