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Mold for detecting mold flow marks of epoxy molding plastic

A technology of epoxy molding compounds and molds, which is applied in the direction of material inspection products, etc., can solve the problems of labor and framework costs, high simulation test costs, and inconspicuous verification effects, etc., to shorten the verification cycle, reduce the cost of consumables, and reduce consumables Effect

Active Publication Date: 2015-01-28
ETERNAL ELECTRONICS MATERIALS (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The original epoxy molding plastic mold flow mark detection needs to be used with the use of the frame, the simulation test cost is relatively high, different packaging forms use different mold simulation tests, the number of operations is too many, it consumes manpower and frame costs, and the verification effect not obvious

Method used

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  • Mold for detecting mold flow marks of epoxy molding plastic
  • Mold for detecting mold flow marks of epoxy molding plastic
  • Mold for detecting mold flow marks of epoxy molding plastic

Examples

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Embodiment

[0019] Combine figure 1 , figure 2 with image 3 As shown, a mold for detecting mold flow marks of epoxy molding compound includes a mold body; the mold body includes an upper module and a lower module; the upper module is provided with an upper module insert; the The lower module is provided with a lower module insert for use with the upper module insert; the lower module insert is composed of a glue inlet channel 1 located in the middle position and a row cavity portion 2 located on both sides; the row cavity portion 2 It communicates with the glue inlet channel 1 through the flow channel 3; the row cavity portion 1 is composed of one or more row cavities 11; the row cavity 11 has a groove structure; the bottom surface of the row cavity 11 is provided with an analog chip 12; The surface of the analog chip 12 is provided with a chrome-plated bright surface layer; the row cavity 11 except for the analog chip 12 is provided with a matte surface material layer on the other surfa...

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Abstract

The invention provides a mold for detecting mold flow marks of epoxy molding plastic, relates to the field of detecting the mold flow marks and solves the problems that the detection of the existing mold flow marks needs to be matched with a frame, different sealing manners need different molds to perform a simulation test, the number of mold operating times is large, and the verifying effect is not obvious. The mold for detecting the mold flow marks of the epoxy molding plastic comprises a mold main body, wherein the mold main body comprises an upper module and a lower module, wherein the upper module is provided with an upper module panel; the lower module is provided with a lower module panel which is matched with the upper module panel for application; the lower module panel consists of a glue inlet passage and a traveling cavity part; the traveling cavity part is divided into a plurality of traveling cavity part function areas; the lower module panel adopts any traveling cavity part function area or a plurality of traveling cavity part function areas. The mold disclosed by the invention can be used for verifying the conditions of the mold flow marks of the epoxy molding plastic in different sealing modes in a disposable manner, the material consumption cost is reduced, the number of the mold operating times is reduced, the labor intensity is reduced, the verifying efficiency is improved, the verifying period is greatly shortened, and the verifying effect is very obvious.

Description

Technical field [0001] The invention relates to the field of mold flow mark detection, in particular to a mold used for mold flow mark detection of epoxy molding compounds. Background technique [0002] When the newly developed epoxy molding compound is packaged on the client side, mold flow marks will occur. This requires simulation and verification of the mold flow marks before packaging. The original epoxy molding compound mold flow marks mostly occur on the body. In terms of packaging form, the mold for detecting flow marks of epoxy molding compound is usually based on the packaging form required by the customer, and the mold is equipped with a bare copper or silver-plated frame for simulation testing. The original epoxy molding compound mold flow mark detection needs to be used with the frame. The simulation test cost is relatively high. Different package forms use different mold simulation tests, which requires many operations, consumes manpower and frame costs, and verifie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N33/44
Inventor 杨春梅张文祥王殿年
Owner ETERNAL ELECTRONICS MATERIALS (KUNSHAN) CO LTD
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