Diode packaging structure

Abstract

The invention relates to a semiconductor structure, and specifically relates to a diode packaging structure. The diode packaging structure comprises a substrate, a packaging body arranged at the upper end surface of the substrate, and a plurality of electrodes arranged at the lower end surface of the substrate. The upper end of the substrate is provided with a groove, the groove is internally provided with a tube core assembly, the upper end surface of the substrate is provided with a bonding block, the tube core assembly and the bonding block are connected through a lead wire, the packaging body and the substrate form a cavity, and the tube core assembly and the bonding block are arranged in the cavity. According to the invention, the problem of bonding between the tube core assembly and the electrodes is effectively solved, the connection between the tube core assembly and the bonding block is facilitated, the production process difficulty is lowered, the production efficiency is improved, the lead wire connecting the tube core assembly and the bonding block is not easily shaken and is not easily broken, and the quality of a manufactured product is enabled to be better. Besides, the diode packaging structure also has the advantages of good sealing performance, high heat dissipation performance and the like.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a diode packaging structure. Background technique [0002] In the existing diode packaging structure, it mainly includes a substrate, a die assembly, a package body, and leads. In a diode packaging structure with high power requirements, since the outer dimensions of the diode are fixed, the die assembly needs to be fired with a multi-layer die. Therefore, in the research and development process, not only the heat dissipation of the die, but also the connection of the electrode pads in the die assembly must be considered. Since the space formed by the substrate and the package is very small, the connection between the electrode pads and the electrodes through wires will be difficult. There is a certain degree of difficulty, and the quality of the produced diode product is likely to be poor due to the shaking of the lead wire during use. Contents of the invention [0003] In view of...

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Problems solved by technology

[0002] In the existing diode packaging structure, it mainly includes a substrate, a die assembly, a package body, and leads. In a diode packaging structure with high power requirements, since the outer dimensions of the diode are fixed, the die assembly needs to be fired with a multi-layer die. Therefore, in the research and development process, not only the heat dissipation of the die, but also the connection of the electrode pads in the die assembly must be considered. Since the space formed by the substrate and the package is very small, the connection between the electrode pads and the electrodes through wires will be difficult. There is a certain degree of difficulty, and the quality of the produced diode products is likely to be poor due to the shaking of the lead wires during use

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