Diode package structure
A packaging structure and diode technology, which is applied in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of poor quality of diode products, and achieve the effects of reducing the difficulty of production process, convenient connection, and not easy to break
Active Publication Date: 2017-10-10
CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
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[0002] In the existing diode packaging structure, it mainly includes a substrate, a die assembly, a package body, and leads. In a diode packaging structure with high power requirements, since the outer dimensions of the diode are fixed, the die assembly needs to be fired with a multi-layer die. Therefore, in the research and development process, not only the heat dissipation of the die, but also the connection of the electrode pads in the die assembly must be considered. Since the space formed by the substrate and the package is very small, the connection between the electrode pads and the electrodes through wires will be difficult. There is a certain degree of difficulty, and the quality of the produced diode products is likely to be poor due to the shaking of the lead wires during use
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[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0017] Such as figure 1 As shown, the diode packaging structure of the present invention may include a substrate 1, a package body 2 disposed on the upper end surface of the substrate 1, and several electrodes disposed on the lower end surface of the substrate 1. The upper end of the substrate 1 has a groove 11, the concave A die assembly 3 is arranged in the groove 11, and a bonding block 4 is provided on the upper surface of the substrate 1. The die...
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The present invention relates to a semiconductor structure, in particular to a diode packaging structure; it includes a substrate, a package body arranged on the upper end surface of the substrate, and several electrodes arranged on the lower end surface of the substrate, the upper end of the substrate has a groove, and the groove is set There is a die component, and a bonding block is provided on the upper surface of the base, the die component and the bonding block are connected by wires, the package and the substrate form a cavity, the die component and the bonding block are all arranged in the chamber; the invention effectively solves the bonding problem between the die assembly and the electrode, not only facilitates the connection between the die assembly and the bonding block, reduces the difficulty of the production process, and improves the production efficiency, but also connects the die assembly and the The lead wire of the bonding block is not easy to shake and break, so that the quality of the produced product is better. In addition, the present invention also has the advantages of good sealing performance and strong heat dissipation performance.
Description
technical field [0001] The invention relates to a semiconductor structure, in particular to a diode packaging structure. Background technique [0002] In the existing diode packaging structure, it mainly includes a substrate, a die assembly, a package body, and leads. In a diode packaging structure with high power requirements, since the outer dimensions of the diode are fixed, the die assembly needs to be fired with a multi-layer die. Therefore, in the research and development process, not only the heat dissipation of the die, but also the connection of the electrode pads in the die assembly must be considered. Since the space formed by the substrate and the package is very small, the connection between the electrode pads and the electrodes through wires will be difficult. There is a certain degree of difficulty, and the quality of the produced diode product is likely to be poor due to the shaking of the lead wire during use. Contents of the invention [0003] In view of...
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IPC IPC(8): H01L23/488H01L29/861H01L25/07
CPCH01L2224/48091H01L2224/48137H01L2224/73265H01L2924/00014
Inventor 杨启达丁小宏杨辉赵志云
Owner CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY