Flexible printed circuit board and its manufacturing method

Abstract

Provided is a flexible circuit board which comprises a transparent first dielectric layer, a first conductive line layer and a second conductive line layer which are arranged at the two opposite sides of the first dielectric layer, a transparent second dielectric layer which is formed on the first conductive line layer and a third conductive line layer which is formed on the second dielectric layer. The surfaces, which are contacted with the first dielectric layer, of the first conductive line layer and the second conductive line layer are a first melanism surface and a second melanism surface respectively. The first conductive line layer is provided with a first opening. The position, which is corresponding to the first opening, of the third conductive line layer is provided with a third opening area. The central area of the third opening area is provided with a copper foil area so that a first identification area block is formed. The invention also relates to a manufacturing method of the flexible circuit board.

Description

technical field [0001] The invention relates to a manufacturing method of a flexible circuit board, in particular to a printed circuit board with an optical identification block and a manufacturing method thereof. Background technique [0002] At present, the prior art generally adopts Surface Mounting Technology (Surface Mounting Technology, STM) to solder the electronic components on the printed circuit board. Generally, when confirming the soldering position of the printed circuit board, the optical recognition method is adopted. The principle of this optical recognition method is: set a recognition block with a different color from the surrounding color on the printed circuit board, and the greater the color difference between the recognition block and the surrounding color The larger the value, the better the recognition effect. [0003] In the prior art, the position of the identification block is mostly covered with a layer of metal, or printing ink is used to make t...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, most of the identification blocks are covered with a layer of metal, or printing ink is used to make the identification block black, so that the color difference between the identification block and the surrounding color is relatively large

However, if ink coating is used to blacken the identification block, the ink is easy to flow and affect the welding; the process of covering the metal usually adopts the method of gold plating on the lead wire. Due to the existence of the lead wire, the surface mounter is prone to produce error

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