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Testing system simulating bottom sludge pollution in-situ remediation

An in-situ repair and test system technology, applied in the field of simulation test systems, can solve problems such as inaccurate test results, disturbance of sediment and water samples, etc., and achieve the effect of facilitating the analysis of in-situ repair effects

Inactive Publication Date: 2015-02-25
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these devices and methods in the prior art will disturb the whole sediment and water samples during the test, resulting in inaccurate test results

Method used

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  • Testing system simulating bottom sludge pollution in-situ remediation
  • Testing system simulating bottom sludge pollution in-situ remediation

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] Such as Figure 1 to Figure 2 As shown, a test system for simulating in-situ restoration of sediment pollution, the system includes a water tank 1, a water quality analysis probe 2, a computer 3, a light source 4 and a fan 5, the water tank 1 is welded by 7mm thick stainless steel plate, The bottom and sides of the water tank 1 are provided with drainage outlets. The length, width and height of the water tank 1 in this embodiment are 2m, 1.5m and 1.7m respectively. The bottom of the water tank 1 is also provided with a bottom mud 6, the thickness of the bottom mud 6 is about 0.5m, and the upper part of the bottom mud 6 is added with a water sample 7, the water sample 7 is river water or lake water, and the depth is about 1m.

[0023] Sampling holes 8 for collecting sediment 6 samples are arranged under one of the side walls of the water tank 1. In this embodime...

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Abstract

The invention discloses a testing system simulating bottom sludge pollution in-situ remediation. The system comprises a water tank, water quality analysis probes, a computer, a light source and a fan, wherein bottom sludge is arranged at the bottom of the water tank; a water sample is added above the bottom sludge; a sampling hole for sampling bottom sludge is formed in the sidewall of the water tank; the light source and the fan are arranged above the water tank and on one side above the water tank respectively; the water quality analysis probes are divided into at least two groups and arranged in a deep water area and a shallow water area of the water sample respectively; the water quality analysis probes are connected with a computer. The testing system simulating bottom sludge pollution in-situ remediation is capable of realizing non-disturbance stratified continuous sampling and capable of monitoring the water sample remediation effect and the change of the environmental conditions in real time, and is convenient, fast, accurate, reliable and the like.

Description

technical field [0001] The invention relates to the technical field of river and lake bottom mud pollution restoration, and more specifically relates to a simulation test system capable of accurately reflecting the in-situ restoration effect of bottom mud and monitoring changes in water body environmental conditions. Background technique [0002] Nowadays, the water pollution in our country is relatively serious, especially for those rivers flowing through urban centers and industrial areas, which receive a large amount of domestic sewage, industrial wastewater and other pollutants carried by surface runoff. After pollutants enter the water body, they are gradually deposited in the bottom mud through adsorption, absorption, precipitation, etc. Due to continuous accumulation, the concentration of pollutants in the bottom mud is usually several times higher than that in the overlying water. At the same time, pollutants maintain a dynamic balance of adsorption and desorption be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N33/24G01N33/18C02F11/00
Inventor 赵林胡保安宋伟男王苗苗毛国柱宋文杰
Owner TIANJIN UNIV
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