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Thick film low power consumption counter-attack under-voltage protection module

An undervoltage protection module and thick film technology, which is applied in the field of electronic technology and microelectronics, can solve the problems of inconvenience of manual replacement operation and high power consumption, and achieve the effects of complicated circuit design, low cost and small size.

Inactive Publication Date: 2015-03-04
程信羲
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a thick-film low-power anti-reverse connection over-undervoltage protection module, which not only needs to overcome the shortcomings of high power consumption of series diodes, avoid the inconvenience of manual replacement operations in parallel diodes, but also increase Overvoltage and undervoltage protection function, realizing multi-functional combination

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] Such as figure 1 As shown, a thick-film low-power anti-reverse connection over-undervoltage protection module includes a low-power consumption anti-reverse connection over-undervoltage protection circuit, SMT components 2, copper-clad Al 2 o 3 Ceramic substrate 1, dual-in-line metal hermetic packaging shell 3; the low-power consumption anti-reverse connection over-undervoltage protection circuit is designed through plane conversion, and the copper-clad Al 2 o 3 The copper conductor pattern is processed on the ceramic substrate 1; the surface mount SMT components 2, copper clad Al 2 o 3 ...

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Abstract

The invention relates to the electronic technique and micro electronic technique, and in particular relates to a thick film low power consumption counter-attack under-voltage protection module. The thick film low power consumption counter-attack under-voltage protection module comprises a low power consumption counter-attack under-voltage protection circuit, an SMT element, copper-covering Al2O3 ceramic substrate and a dual in-line type metal hermetic encapsulation shell; the low power consumption counter-attack under-voltage protection circuit is designed by plane conversion and the copper conductive pattern is formed on the copper-covering Al2O3 ceramic substrate; the thick film assembly technology is adopted for assembling the surface-sticking SMT element, the copper-covering Al2O3 ceramic substrate and the dual in-line type metal hermetic encapsulation shell together. The thick film low power consumption counter-attack under-voltage protection module overcomes the defect of big power dissipation of the series diode, avoids the inconvenience of manual work replacing operation of parallel connection diode, increases the under-voltage protection function and realizes the multifunction combination.

Description

technical field [0001] The invention relates to electronic technology and microelectronic technology, in particular to a thick-film low-power consumption anti-reverse connection overvoltage and undervoltage protection module. Background technique [0002] Most analog and digital processing circuits have certain range requirements for the DC supply voltage. If the voltage is too low, it will trigger a false action, and if the voltage is too high, it will damage it; especially when the polarity of the power supply voltage is reversed, it will definitely bring disastrous consequences to the processing circuit. [0003] Before the present invention was proposed, most anti-reverse connection measures were implemented by connecting forward diodes in series in the power supply circuit to block the reverse connection voltage, or connecting reverse diodes in parallel and series fuses in the power supply circuit. [0004] For larger supply current, the power consumption due to the fo...

Claims

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Application Information

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IPC IPC(8): H02H3/02H02H3/20H02H3/24H02H11/00
Inventor 程信羲
Owner 程信羲
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