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Heat radiator framework

A cooling frame and radiator technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of fan damage, poor cooling effect, and affecting the life of cooling fans, etc., to achieve low manufacturing costs , Good cooling effect, simple structure

Inactive Publication Date: 2015-03-11
WUXI HONGSHENG ALUMINUM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, with the wide application of computers, the frequency of CPU computing clocks continues to increase while generating high power consumption and high temperature, which will affect the stability and service life of the product system. The existing cooling pads are all single-fan cooling fans. Not very big, the heat dissipation effect is not good, and after a period of use of the heat dissipation pad, a large amount of dust is adsorbed on the fan blades of the fan, which greatly reduces the heat dissipation effect of the fan, and is easy to cause damage to the fan and affect heat dissipation fan life

Method used

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Embodiment Construction

[0012] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0013] Such as Figure 1-2 As shown, a radiator frame includes a heat sink body 1, the two ends of the heat sink body are round, and the middle is an inwardly sunken waist, and the two ends of the heat sink are each provided with a fan installation port 2, and inside the fan mount port Features suction fan. The cooling frame body is provided with four supporting legs 3, and pads 4 are bonded to the supporting legs and the parts connecting the supporting legs on the cooling frame. The inner cavity of the supporting leg is hollow.

[0014] The invention has a simple structure, the body is provided with four supporting legs, the supporting legs are hollow, less mater...

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Abstract

The invention belongs to the field of a computer accessory, and discloses a heat radiator framework. The heat radiator framework comprises a heat radiation frame body, wherein the two ends of the heat radiation frame body are in a round shape, the middle of the heat radiation frame body is an inwards recessed waist part, the two ends of the heat radiation frame are respectively provided with a fan installing opening, four support legs are arranged in the heat radiation frame body, pad blocks are respectively bonded on the support legs and on positions, connected with the support leg parts, of the heat radiation frame. An air suction type fan is arranged in each fan installing opening, and an inner cavity of each support leg is in a hollow shape. The heat radiator framework has the advantages that the structure is simple and convenient, and the heat radiation efficiency is high.

Description

technical field [0001] The invention belongs to the field of computer equipment, and in particular relates to a radiator frame. Background technique [0002] At present, with the wide application of computers, the frequency of CPU computing clocks continues to increase while generating high power consumption and high temperature, which will affect the stability and service life of the product system. The existing cooling pads are all single-fan cooling fans. Not very big, the heat dissipation effect is not good, and after a period of use of the heat dissipation pad, a large amount of dust is adsorbed on the fan blades of the fan, which greatly reduces the heat dissipation effect of the fan, and is easy to cause damage to the fan and affect heat dissipation The lifetime of the fan. Contents of the invention [0003] The invention aims to overcome the defects of the prior art, and provides a radiator frame, which has the advantages of simple structure and high heat dissipat...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 王洪初
Owner WUXI HONGSHENG ALUMINUM IND