Circuit board sign method based on bad mark two-dimensional codes

A technology of two-dimensional codes and circuit boards, which is applied in printed circuits, printed circuit manufacturing, circuit inspection/monitoring/correction, etc., can solve problems such as shortening production cycle and reducing misjudgment rate, so as to save identification time and improve production efficiency , the effect of stable performance

Active Publication Date: 2015-03-11
苏州河图电子科技有限公司
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this function can only reduce the misjudgment rate, it does not help to shorten the production cycle and imp

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] Embodiments of the invention include:

[0022] A method for marking circuit boards based on two-dimensional codes of bad pixels, comprising the following steps:

[0023] (1) Use the detection device to detect and record the bad points of all sub-circuit boards in the circuit board;

[0024] (2) Encode the bad points of the circuit board into a hexadecimal QR code:

[0025] The total number of rows and the total number of columns of the sub-board are represented by hexadecimal codes,

[0026] Use binary "0" ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a circuit board sign method based on bad mark two-dimensional codes. The method comprises the following steps: (1), detecting and recording bad mark conditions of all sub circuit boards in a circuit board by use of a detection apparatus; (2), performing encoding through hexadecimal-system two-dimensional codes; (3), mounting the bad mark two-dimensional codes on the circuit board in a surface mounting mode or a laser mode; and (4), scanning the bad mark two-dimensional codes during application. Through such a mode, the circuit board sign method based on the bad mark two-dimensional codes has the advantages of optimized design, novel method, stable performance, lower cost, shorter identification time, higher production efficiency, convenient batch management and the like, thereby having wide market prospect on popularization of the circuit board sign method based on the bad mark two-dimensional codes.

Description

technical field [0001] The invention relates to the field of electronic production, in particular to a method for marking circuit boards based on two-dimensional codes of bad pixels. Background technique [0002] The high integration of electronic technology makes the circuit board size of products smaller and smaller. However, in the production process, in order to facilitate the production of electronic assembly, multiple small circuit boards (sub-circuit boards) will be spliced ​​into a large board (called jigsaw board or connecting board in the industry). The reserved position is divided into a single small board. The number of jigsaw boards ranges from 10 or 20 pieces to as many as 50 or more, and some even exceed 100 pieces, such as circuit boards in memory cards, wireless network cards, mobile phones, and tablet computers. Even the number of boards is no less than 30 pieces. It is the preferred process to improve production efficiency in the industry. [0003] Howe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/00
CPCH05K3/00H05K2203/16
Inventor 李孟超
Owner 苏州河图电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products