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Imprinting device and imprinting method

A cavity and carrier technology, which is applied to instruments, electrical components, circuits, etc., can solve the problems of uneven separation force of patterned microstructures 90, poor quality of patterned microstructures 90, and poor imprinting quality, etc. Achieve the effect of improving process yield

Inactive Publication Date: 2015-03-18
AUROTEK CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the existing imprinting device 1, the air chamber 14 is formed by the fixing member 13 and the mold 12, so when assembling the fixing member 13 and the mold 12, gaps are likely to occur, thus causing a problem of poor airtightness , causing the air pressure in the air chamber 14 to be prone to error
[0011] In addition, the mold 12 is fixed on the fixture 13, so the mold 12 and the substrate 9 are directly combined in a face-to-face manner, so air bubbles are easily generated between the mold 12 and the substrate 9, resulting in the patterning The quality of the microstructure 90 is poor, making the substrate 9 a defective product
[0012] Moreover, the mold 12 is fixed on the fixing member 13, so it cannot be replaced, so that the imprinting quality of the mold 12 will deteriorate with the increase of use time, making the base material 9 a defective product.
Specifically, after a long period of use, the mold 12 will be worn and even deformed, so that when the mold 12 is separated from the substrate 9, the separation force of the patterned microstructure 90 is uneven, causing the patterned microstructure Part of the material of 90 will remain on the mold 120, causing the substrate 9 to become a defective product, and when the patterned microstructure is produced next time, the residue on the mold 120 will affect the pattern of the patterned microstructure, Cause the next substrate to become a defective product

Method used

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  • Imprinting device and imprinting method

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Embodiment Construction

[0054] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0055] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "upper", "lower",...

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Abstract

The invention provides an imprinting device and an imprinting method. The imprinting device comprises a cavity, a bearing piece arranged at the bottom side of the cavity, and an elastic mold suspended in the cavity. The elastic mold has a natural drooping property, and a base material on the elastic mold is driven by the bearing piece to upwards push and press the elastic mold, so that a mold shape of the elastic mold is naturally fitted and imprinted on the base material. The elastic mold and the base material are laminated from the middle part to the side edge and the elastic mold is changed into a plane from a bent shape, so that air bubbles are not formed between the elastic mold and the base material, and the yield of a production process can be effectively improved.

Description

technical field [0001] The invention relates to an embossing technology, in particular to an embossing device and an embossing method. Background technique [0002] With the vigorous development of the electronic industry, electronic products tend to be thinner and smaller in form, and gradually enter the research and development direction of high performance, high function, and high speed in terms of function. Among them, light-emitting diodes (LEDs) have become the development trend of lighting electronic products due to their advantages of long life, small size, high shock resistance and low power consumption. [0003] In the process of making LEDs, it is necessary to form a patterned microstructure on the film of the chip, such as patterned photoresist. In the early days, the patterning process was carried out by yellow light lithography to form the microstructure, but the process of yellow light lithography is cumbersome and the process It takes a long time, and it can...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00G03F7/00
CPCG03F7/0017H01L21/67092H01L33/22
Inventor 李昇儒
Owner AUROTEK CORP