High-power plane heating unit liquid-cooling heat dissipating device and manufacturing method thereof

Abstract

The invention discloses a high-power plane heating unit liquid-cooling heat dissipating device which comprises a cooling liquid driving device (14) and a heat dissipator (13). The heat dissipator (13) is composed of a heat dissipating sectional material (18) and sealing plug blocks (12), the heat dissipating sectional material (18) is a flat-section structure with cavities, a heat dissipating face (2) and mounting faces (5) used for mounting of a plane heating unit are arranged on the surface of the heat dissipating sectional material (18), cooling liquid channels and mounting pipelines (3) are arranged inside the heat dissipating sectional material (18), and a liquid inlet (10) and a liquid outlet (11) of the heat dissipator are communicated with the cooling liquid channels. By adoption of the structure, the heat dissipating sectional material is formed at a time, can be cut according to the shape of the plane heating unit and can be provided with the liquid inlet and the liquid outlet at different positions, heat dissipating devices of different heat dissipating structures can be manufactured only through simple machining, multiple heat dissipators can be assembled in parallel to be matched with the width of the plane heating unit, and heat dissipating requirements of the plane heating units in different shapes are met.

Description

technical field [0001] The invention relates to a device for heat dissipation of a high-power planar heating body, which can conveniently implement liquid cooling to solve the problem of heat dissipation of a high-power heating planar body. Planar heating elements usually include CPU, PTC cooling chips, high-power semiconductor lighting equipment, special-purpose lighting equipment, built-in power supply modules, backlight module modules, and heating power devices of electronic equipment (integrated circuits, thyristors, transformers, power supply modules) A heating element with a flat contact surface. Background technique [0002] At present, generally high-power heating elements adopt liquid cooling to dissipate heat, such as power modules and various semiconductor heating elements, but the shapes of various heating elements are different, and there are different requirements for the size of the radiator, especially some high-power semiconductor lighting The shapes of equ...

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Problems solved by technology

[0002] At present, generally high-power heating elements adopt liquid cooling to dissipate heat, such as power modules and various semiconductor heating elements, but the shapes of various heating elements are different, and there are different requirements for the size of the radiator, especially some high-power semiconductor lighting The shape of equipment, such as high-power LEDs, is ever-changing, so there are also different requirements for the size of the radiator. How to quickly and cost-effectively manufacture a heat dissipation component of an appropriate size is a problem that currently exists

[0003] CN201210532398 patent discloses a cooling system suitable for high-power LED la

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