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Multilayer ceramic electronic component and board mounted with the multilayer ceramic electronic component

A technology of multi-layer ceramics and electronic components, applied in the direction of printed circuits, electrical components, laminated capacitors, etc., which are connected with non-printed electrical components, and can solve problems such as vibration.

Active Publication Date: 2017-09-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the dielectric layer has piezoelectric and electrostrictive properties, when a direct current (DC) or alternating current (AC) voltage is applied to a multilayer ceramic capacitor, a piezoelectric phenomenon is generated between the inner electrodes, thereby generating vibration

Method used

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  • Multilayer ceramic electronic component and board mounted with the multilayer ceramic electronic component
  • Multilayer ceramic electronic component and board mounted with the multilayer ceramic electronic component
  • Multilayer ceramic electronic component and board mounted with the multilayer ceramic electronic component

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Embodiment Construction

[0044] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0045] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0046] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0047] Multilayer Ceramic Electronic Assemblies

[0048] figure 1 is a partially cutaway perspective view schematically showing a multilayer ceramic capacitor according to an exemplary embodiment of the present disclosure.

[0049] Figure 2A Yes figure 1 The cross-sectional view of the multilayer ceramic capacitor taken al...

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Abstract

Disclosed are a multilayer ceramic electronic component and a board mounted with the multilayer ceramic electronic component, the multilayer ceramic electronic component has: a main body, a thickness (t) and a width (w) satisfying the formula t / w>1.0 ; The upper part of the main body includes first and second internal electrodes with an average width of M1; the lower part of the main body includes first and second internal electrodes with an average width of M2, satisfying M1>M2.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2013-0111706 filed with the Korean Intellectual Property Office on September 17, 2013, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer ceramic electronic component and a board on which the multilayer ceramic electronic component is mounted. Background technique [0003] With the recent trend of miniaturization of electronic products, the demand for multilayer ceramic electronic components having small size and large capacitance has increased. [0004] Accordingly, dielectric layers and internal electrodes have been intended to be thinned and stacked by various methods. Recently, as the thickness of dielectric layers has become thinner, multilayer ceramic electronic components in which the number of stacked layers has increased have been manufactured. [0005] As miniaturization of multilayer ceramic electronic co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/232H05K1/18
CPCH01G2/065H01G4/012H01G4/12H01G4/30H01G4/35H01G2/06H01G4/005H01G4/248
Inventor 柳泰列小野雅章
Owner SAMSUNG ELECTRO MECHANICS CO LTD